AMD Xilinx
XC7K70T-2FB676C
XC7K70T-2FB676C ECAD Model
XC7K70T-2FB676C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Number of Inputs | 185 | |
| Number of Outputs | 185 | |
| Number of Logic Cells | 65600 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.818 GHz | |
| Power Supplies | 1,1.8,3.3 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC7K70T-2FB676C Datasheet Download
XC7K70T-2FB676C Overview
The chip model XC7K70T-2FB676C is a microprocessor designed by Xilinx and is the latest generation of FPGA chips. It is mainly used in the fields of industrial control, communication, and aerospace. It has a high-performance computing capability, low power consumption, and strong scalability. It is a perfect choice for a variety of applications.
The XC7K70T-2FB676C chip is based on the 7-series architecture, which is designed to be highly flexible, scalable, and configurable. With its advanced technology, the chip can support a wide range of applications, including high-speed data transfer, high-speed signal processing, and advanced communication systems. It also has a high-performance floating-point unit, which enables it to handle complex calculations quickly and accurately.
In terms of future development, the XC7K70T-2FB676C chip is expected to be used in more sophisticated communication systems, such as 5G and 6G networks. It is also likely to be used in intelligent scenarios, such as autonomous driving and smart home systems. Furthermore, the chip is expected to be further upgraded to support the development of fully intelligent systems.
In terms of industry trends, the XC7K70T-2FB676C chip is expected to be widely used in the near future. It is likely to be the preferred choice for many applications due to its advanced features and low power consumption. Moreover, the chip is expected to be used in more advanced communication systems, such as 5G and 6G networks, as well as in intelligent scenarios, such as autonomous driving and smart home systems.
To conclude, the XC7K70T-2FB676C chip is a highly advanced microprocessor designed by Xilinx. It is expected to be widely used in the near future due to its advanced features and low power consumption. It is also likely to be used in more sophisticated communication systems, such as 5G and 6G networks, as well as in intelligent scenarios, such as autonomous driving and smart home systems. Furthermore, the chip is expected to be further upgraded to support the development of fully intelligent systems.
5,148 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $311.7509 | $311.7509 |
| 10+ | $308.3987 | $3,083.9872 |
| 100+ | $291.6379 | $29,163.7920 |
| 1000+ | $274.8771 | $137,438.5600 |
| 10000+ | $251.4120 | $251,412.0000 |
| The price is for reference only, please refer to the actual quotation! | ||