AMD Xilinx
XC7K70T-1FB676C
XC7K70T-1FB676C ECAD Model
XC7K70T-1FB676C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Number of Inputs | 185 | |
| Number of Outputs | 185 | |
| Number of Logic Cells | 65600 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.818 GHz | |
| Power Supplies | 1,1.8,3.3 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC7K70T-1FB676C Datasheet Download
XC7K70T-1FB676C Overview
The XC7K70T-1FB676C chip model is a high-performance, versatile and reliable chip model designed for digital signal processing, embedded processing, and image processing. It is developed using the latest version of HDL language, making it an ideal choice for high-performance applications.
The XC7K70T-1FB676C chip model offers a wide range of advantages, including its ability to process large amounts of data quickly and accurately, as well as its low power consumption and high clock frequency. Furthermore, its versatile design allows it to be used in a variety of embedded and image processing applications. Moreover, its small size and light weight make it ideal for use in portable devices.
Given its versatility and performance, the XC7K70T-1FB676C chip model is expected to be widely used in various industries in the future. In the medical industry, for example, the chip model can be used to develop advanced medical imaging systems. In the automotive industry, it can be used in the development of autonomous driving systems. In the consumer electronics industry, it can be used to develop high-performance gaming consoles and smart home devices.
The XC7K70T-1FB676C chip model can also be applied to the development and popularization of future intelligent robots. Its high-speed processing capabilities make it ideal for developing robots with advanced artificial intelligence capabilities. Furthermore, its low power consumption makes it suitable for use in mobile robots. To use the XC7K70T-1FB676C chip model effectively, technical talents with knowledge of HDL language and robotics are required.
In conclusion, the XC7K70T-1FB676C chip model is a versatile and reliable chip model that offers a wide range of advantages for digital signal processing, embedded processing, and image processing applications. It is expected to be widely used in various industries in the future, and can also be applied to the development and popularization of future intelligent robots. To use the model effectively, technical talents with knowledge of HDL language and robotics are required.
2,976 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $235.3979 | $235.3979 |
| 10+ | $232.8667 | $2,328.6672 |
| 100+ | $220.2109 | $22,021.0920 |
| 1000+ | $207.5551 | $103,777.5600 |
| 10000+ | $189.8370 | $189,837.0000 |
| The price is for reference only, please refer to the actual quotation! | ||