
AMD Xilinx
XC7K420T-3FF901E
XC7K420T-3FF901E ECAD Model
XC7K420T-3FF901E Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Active | |
Number of Inputs | 380 | |
Number of Outputs | 380 | |
Number of Logic Cells | 416960 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Clock Frequency-Max | 1.818 GHz | |
Power Supplies | 1,1.8,3.3 V | |
JESD-30 Code | S-PBGA-B900 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 900 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA900,30X30,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A991.D |
XC7K420T-3FF901E Datasheet Download
XC7K420T-3FF901E Overview
The XC7K420T-3FF901E chip model is a revolutionary product in the semiconductor industry. Developed by Xilinx, this model is designed to provide customers with a cost-effective, low-power solution for their applications. It is equipped with a high-performance FPGA fabric, on-chip memory, and a wide range of I/O options.
The XC7K420T-3FF901E chip model offers several advantages over traditional chips. It is capable of supporting high-speed data transfer, with a maximum bandwidth of up to 12.5 Gbps. This makes it suitable for a wide range of applications, such as high-speed networking, embedded systems, and multimedia. Additionally, it features a low power consumption, making it an ideal choice for battery-powered applications.
The expected demand for the XC7K420T-3FF901E chip model is likely to increase in the future. This is mainly due to the increasing demand for high-speed data transfer, as well as the need for low-power solutions. With the development of 5G technology, the chip model will be even more in demand, as it can provide customers with a cost-effective solution for their 5G-related applications.
The original design intention of the XC7K420T-3FF901E chip model is to provide customers with a cost-effective, low-power solution for their applications. It is equipped with a high-performance FPGA fabric, on-chip memory, and a wide range of I/O options. In the future, it is possible for the chip model to be upgraded with new features and capabilities. This could include support for higher-speed data transfer, as well as the addition of new I/O options.
The XC7K420T-3FF901E chip model can be applied to a wide range of advanced communication systems. It is suitable for high-speed networking, embedded systems, and multimedia applications. In addition, it is also suitable for intelligent scenarios, such as artificial intelligence (AI) and machine learning (ML). In the future, it is likely that the chip model will be used in the era of fully intelligent systems, as it is capable of supporting high-speed data transfer, low power consumption, and a wide range of I/O options.
Overall, the XC7K420T-3FF901E chip model is an ideal choice for customers who are looking for a cost-effective, low-power solution for their applications. It is capable of supporting high-speed data transfer, low power consumption, and a wide range of I/O options. In the future, it is likely to be used in the era of fully intelligent systems, as it is suitable for a wide range of advanced communication systems, as well as intelligent scenarios.
3,985 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $5,091.4710 | $5,091.4710 |
10+ | $5,036.7240 | $50,367.2400 |
100+ | $4,762.9890 | $476,298.9000 |
1000+ | $4,489.2540 | $2,244,627.0000 |
10000+ | $4,106.0250 | $4,106,025.0000 |
The price is for reference only, please refer to the actual quotation! |