AMD Xilinx
XC7K410T-L2FFG676E
XC7K410T-L2FFG676E ECAD Model
XC7K410T-L2FFG676E Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Contact Manufacturer | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 400 | |
| Number of Outputs | 400 | |
| Number of Logic Cells | 406720 | |
| Number of CLBs | 31775 | |
| Combinatorial Delay of a CLB-Max | 910 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 31775 CLBS | |
| Additional Feature | ALSO OPERATES AT 1 V SUPPLY | |
| Power Supplies | 0.9,1.8,3.3 V | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 3.37 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA676,26X26,40 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Pin Count | 676 |
XC7K410T-L2FFG676E Datasheet Download
XC7K410T-L2FFG676E Overview
The XC7K410T-L2FFG676E chip model is a powerful and versatile tool for digital signal processing, embedded processing, and image processing. This model is designed to be used with the HDL language, making it an ideal solution for high-performance applications.
The XC7K410T-L2FFG676E chip model provides many advantages, such as high-speed operation, low power consumption, and scalability. It is also highly reliable and efficient, making it an ideal choice for a variety of industries. With its excellent performance, the XC7K410T-L2FFG676E chip model is expected to become increasingly popular in the future.
The XC7K410T-L2FFG676E chip model is likely to become the preferred choice for many industries in the coming years. This is due to its ability to provide high-performance solutions for a wide range of applications. This chip model is also expected to be the go-to choice for new technologies, as it is capable of supporting the latest technologies.
The XC7K410T-L2FFG676E chip model is expected to be in high demand in the future as it offers a great combination of performance and efficiency. This model is also expected to be used in a variety of industries, such as automotive, industrial, medical, and consumer electronics.
The XC7K410T-L2FFG676E chip model is an excellent choice for many applications, as it offers a wide range of features and benefits. This model is likely to become increasingly popular in the future, as it is capable of providing high-performance solutions for a variety of industries. Additionally, it is expected to be the go-to choice for new technologies, as it is capable of supporting the latest technologies.
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2,076 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,714.9349 | $1,714.9349 |
| 10+ | $1,696.4947 | $16,964.9472 |
| 100+ | $1,604.2939 | $160,429.3920 |
| 1000+ | $1,512.0931 | $756,046.5600 |
| 10000+ | $1,383.0120 | $1,383,012.0000 |
| The price is for reference only, please refer to the actual quotation! | ||