AMD Xilinx
XC7K410T-3FB900E
XC7K410T-3FB900E ECAD Model
XC7K410T-3FB900E Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Number of Inputs | 500 | |
| Number of Outputs | 500 | |
| Number of Logic Cells | 406720 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.818 GHz | |
| Power Supplies | 1,1.8,3.3 V | |
| JESD-30 Code | S-PBGA-B900 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC7K410T-3FB900E Datasheet Download
XC7K410T-3FB900E Overview
The XC7K410T-3FB900E chip model is a powerful tool for a variety of applications in the industry. It is designed to provide high-performance, energy-efficient solutions for a range of applications, including networking, storage, and automotive applications. The chip model has a wide range of features and capabilities, making it suitable for a variety of applications.
The XC7K410T-3FB900E chip model is designed to provide high performance and energy efficiency in a variety of applications. It features a high-speed, low-power processor core, a wide range of memory and storage options, and a variety of I/O interfaces. This makes the chip model suitable for a range of applications, including networking, storage, and automotive applications. The chip model also has a wide range of features and capabilities, making it suitable for a wide range of applications.
The expected demand trends for the XC7K410T-3FB900E chip model in the future are likely to be positive. As technology advances, more applications are likely to require the chip model, such as networking and storage applications. This is likely to drive up demand for the chip model in the future.
The XC7K410T-3FB900E chip model can be used in a variety of intelligent scenarios. It is suitable for use in networks, and can be used to provide networked solutions for a variety of applications. It can also be used in intelligent systems, such as autonomous vehicles and robotics. The chip model is designed to provide high-performance, energy-efficient solutions for a variety of applications, and is suitable for use in a variety of intelligent systems.
The product description and specific design requirements of the XC7K410T-3FB900E chip model are outlined in the product documentation. The chip model has a wide range of features and capabilities, making it suitable for a variety of applications. It features a high-speed, low-power processor core, a wide range of memory and storage options, and a variety of I/O interfaces. The chip model also has a wide range of features and capabilities, making it suitable for a wide range of applications.
There are a number of case studies and precautions to consider when using the XC7K410T-3FB900E chip model. It is important to consider the power requirements of the chip model, as well as the thermal requirements. Additionally, it is important to consider the design and layout of the chip model, as well as the design and layout of the board. It is also important to consider the software requirements of the chip model, as well as the software requirements of the board.
In conclusion, the XC7K410T-3FB900E chip model is a powerful tool for a variety of applications in the industry. It is designed to provide high-performance, energy-efficient solutions for a range of applications, including networking, storage, and automotive applications. The chip model has a wide range of features and capabilities, making it suitable for a variety of applications. The expected demand trends for the XC7K410T-3FB900E chip model in the future are likely to be positive, and it can be used in a variety of intelligent scenarios. The product description and specific design requirements of the chip model are outlined in the product documentation, and there are a number of case studies and precautions to consider when using the chip model.
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1,513 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $3,058.4092 | $3,058.4092 |
| 10+ | $3,025.5230 | $30,255.2304 |
| 100+ | $2,861.0924 | $286,109.2440 |
| 1000+ | $2,696.6618 | $1,348,330.9200 |
| 10000+ | $2,466.4590 | $2,466,459.0000 |
| The price is for reference only, please refer to the actual quotation! | ||