XC7K325T-L2FFG900E

The XC7K325T-L2FFG900E is a Field Programmable Gate Array (FPGA) chip model manufactured by Xilinx Inc. It is based on the Kintex-7 family of FPGAs and is designed to meet the needs of high-end applications.

The chip is housed in a 900-pin Flip-Chip Ball Grid Array (FCBGA) package and has a power rating of 7.5W. It features a total of 325K logic cells, 8,192 Digital Signal Processing (DSP) slices, and a high-speed transceiver count of 32. It also has a high-performance memory subsystem with up to 8GB of DDR3 memory and up to 1TB of QDR II+ SRAM.

The XC7K325T-L2FFG900E is a high-performance chip with a wide range of applications. It is well suited for applications such as digital signal processing, image processing, and video processing. It is also suitable for applications such as high-speed networking, wireless communications, and high-end computing.

In addition, the chip is also ideal for applications such as aerospace and defense, automotive, consumer electronics, and industrial automation. It is also suitable for use in medical imaging, robotics, and machine learning.

The XC7K325T-L2FFG900E is a powerful and reliable chip with a wide range of applications. It is designed to meet the needs of high-end applications and is well suited for a variety of applications.