XC7K325T-L2FBG900E

The XC7K325T-L2FBG900E is a Field Programmable Gate Array (FPGA) chip from Xilinx. It is a high-performance, low-power device that is well-suited for a wide range of applications. It has a large capacity of 325,000 logic cells and is built using a 28nm process technology. It has a total of 1,440 DSP slices, 8,640 Kb of block RAM and over 300 I/O pins. It also features advanced features such as integrated transceivers, clock management and system monitoring.

The XC7K325T-L2FBG900E is designed for high-speed, low-power applications. It is capable of delivering up to 1.2TFLOPS of performance at 200MHz. It has a wide range of I/O standards, including LVDS, PCIe, SATA, Ethernet, and USB. It also supports multiple protocols such as AXI, AMBA, and Xilinx proprietary protocols.

The XC7K325T-L2FBG900E is well-suited for a variety of applications, including networking, storage, signal processing, and embedded systems. It is ideal for applications that require high throughput and low power consumption. It can be used in a variety of industries, such as automotive, industrial, aerospace, defense, and medical.

Overall, the XC7K325T-L2FBG900E is a powerful and versatile FPGA chip that is suitable for a variety of applications. It has a large capacity and advanced features, making it a great choice for high-performance, low-power applications.