AMD Xilinx
XC7K325T-L2FB900E
XC7K325T-L2FB900E ECAD Model
XC7K325T-L2FB900E Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Number of Inputs | 500 | |
| Number of Outputs | 500 | |
| Number of Logic Cells | 326080 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.286 GHz | |
| Power Supplies | 0.9,1.8,3.3 V | |
| JESD-30 Code | S-PBGA-B900 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC7K325T-L2FB900E Datasheet Download
XC7K325T-L2FB900E Overview
The XC7K325T-L2FB900E chip model is a cutting-edge technology designed by Xilinx, a leading provider of programmable logic devices. It is a mid-range field programmable gate array (FPGA) that is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications. This chip model is designed to be able to handle a wide range of data processing tasks with its versatile architecture and powerful performance.
The XC7K325T-L2FB900E chip model offers a number of advantages, including a rich feature set, high-speed performance, and low power consumption. It is also capable of supporting a variety of programming languages, including the HDL language, making it a very versatile choice for many applications. This chip model is also designed to be able to handle a wide range of data processing tasks with its versatile architecture and powerful performance.
The XC7K325T-L2FB900E chip model is expected to see increasing demand in the future due to its versatile design and powerful performance. This chip model is particularly well suited for use in a variety of industries, such as automotive, aerospace, defense, industrial automation, medical, and communications. It is also expected to be used in advanced communication systems, as it can handle the high data rates and complexity of these systems.
The XC7K325T-L2FB900E chip model was designed with the intention of providing users with a powerful and versatile solution for their data processing needs. It is also designed to be easily upgradable, allowing users to take advantage of the latest technologies and features. This chip model is also capable of handling a wide range of data processing tasks, making it a great choice for a variety of applications.
The XC7K325T-L2FB900E chip model is a powerful and versatile solution for a variety of data processing tasks. It is expected to see increasing demand in the future due to its versatile design and powerful performance. This chip model is also capable of handling a wide range of data processing tasks and is suitable for use in advanced communication systems. With its upgradable design, users can take advantage of the latest technologies and features.
5,682 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,747.0871 | $1,747.0871 |
| 10+ | $1,728.3012 | $17,283.0124 |
| 100+ | $1,634.3718 | $163,437.1821 |
| 1000+ | $1,540.4424 | $770,221.2030 |
| 10000+ | $1,408.9412 | $1,408,941.2250 |
| The price is for reference only, please refer to the actual quotation! | ||