
AMD Xilinx
XC7K325T-L2FB676E
XC7K325T-L2FB676E ECAD Model
XC7K325T-L2FB676E Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Active | |
Number of Inputs | 400 | |
Number of Outputs | 400 | |
Number of Logic Cells | 326080 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Clock Frequency-Max | 1.286 GHz | |
Power Supplies | 0.9,1.8,3.3 V | |
JESD-30 Code | S-PBGA-B676 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 676 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA676,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC7K325T-L2FB676E Datasheet Download
XC7K325T-L2FB676E Overview
The XC7K325T-L2FB676E is a high-performance chip model developed by Xilinx, a leading provider of programmable logic solutions. It is designed for digital signal processing, embedded processing, and image processing applications, and requires the use of HDL language. The model is equipped with the latest technology and features, including the 7-series FPGA family, which provides the highest levels of system performance, and the UltraScale architecture, which delivers the highest levels of system integration.
The XC7K325T-L2FB676E has a number of advantages that make it well-suited for high-performance applications. It has a large capacity, allowing it to handle more operations and data at once. It also has a low power consumption, which reduces energy costs and makes it more efficient. Additionally, it has a high-speed interface and a wide range of I/O options, allowing it to easily connect to other devices and systems.
The demand for the XC7K325T-L2FB676E model is expected to increase in the future, as more and more applications require high-performance chips. For example, the chip is well-suited for use in autonomous vehicles, drones, and robots, as it can process large amounts of data quickly and accurately. Additionally, the chip can be used in networks and other intelligent scenarios, such as smart homes and factories.
The XC7K325T-L2FB676E is also well-suited for use in the era of fully intelligent systems. It can be used to process large amounts of data quickly and accurately, allowing for faster and more efficient decision-making. Additionally, the chip can be used to create and maintain complex networks, which can be used to control and monitor various systems.
In conclusion, the XC7K325T-L2FB676E is a high-performance chip model that is well-suited for use in a variety of applications, including digital signal processing, embedded processing, image processing, and networks. It has a large capacity, low power consumption, and a high-speed interface, making it an ideal choice for high-performance applications. The demand for the chip is expected to increase in the future, as more and more applications require high-performance chips. Additionally, the chip is well-suited for use in the era of fully intelligent systems, as it can process large amounts of data quickly and accurately.
1,289 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $1,529.6454 | $1,529.6454 |
10+ | $1,513.1976 | $15,131.9760 |
100+ | $1,430.9586 | $143,095.8600 |
1000+ | $1,348.7196 | $674,359.8000 |
10000+ | $1,233.5850 | $1,233,585.0000 |
The price is for reference only, please refer to the actual quotation! |