XC7K325T-L2FB676E
XC7K325T-L2FB676E
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rohs

AMD Xilinx

XC7K325T-L2FB676E


XC7K325T-L2FB676E
F20-XC7K325T-L2FB676E
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS
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XC7K325T-L2FB676E ECAD Model


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XC7K325T-L2FB676E Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Active
Number of Inputs 400
Number of Outputs 400
Number of Logic Cells 326080
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 1.286 GHz
Power Supplies 0.9,1.8,3.3 V
JESD-30 Code S-PBGA-B676
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC7K325T-L2FB676E Datasheet Download


XC7K325T-L2FB676E Overview



The XC7K325T-L2FB676E is a high-performance chip model developed by Xilinx, a leading provider of programmable logic solutions. It is designed for digital signal processing, embedded processing, and image processing applications, and requires the use of HDL language. The model is equipped with the latest technology and features, including the 7-series FPGA family, which provides the highest levels of system performance, and the UltraScale architecture, which delivers the highest levels of system integration.


The XC7K325T-L2FB676E has a number of advantages that make it well-suited for high-performance applications. It has a large capacity, allowing it to handle more operations and data at once. It also has a low power consumption, which reduces energy costs and makes it more efficient. Additionally, it has a high-speed interface and a wide range of I/O options, allowing it to easily connect to other devices and systems.


The demand for the XC7K325T-L2FB676E model is expected to increase in the future, as more and more applications require high-performance chips. For example, the chip is well-suited for use in autonomous vehicles, drones, and robots, as it can process large amounts of data quickly and accurately. Additionally, the chip can be used in networks and other intelligent scenarios, such as smart homes and factories.


The XC7K325T-L2FB676E is also well-suited for use in the era of fully intelligent systems. It can be used to process large amounts of data quickly and accurately, allowing for faster and more efficient decision-making. Additionally, the chip can be used to create and maintain complex networks, which can be used to control and monitor various systems.


In conclusion, the XC7K325T-L2FB676E is a high-performance chip model that is well-suited for use in a variety of applications, including digital signal processing, embedded processing, image processing, and networks. It has a large capacity, low power consumption, and a high-speed interface, making it an ideal choice for high-performance applications. The demand for the chip is expected to increase in the future, as more and more applications require high-performance chips. Additionally, the chip is well-suited for use in the era of fully intelligent systems, as it can process large amounts of data quickly and accurately.



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Unit Price: $1,644.78
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Pricing (USD)

QTY Unit Price Ext Price
1+ $1,529.6454 $1,529.6454
10+ $1,513.1976 $15,131.9760
100+ $1,430.9586 $143,095.8600
1000+ $1,348.7196 $674,359.8000
10000+ $1,233.5850 $1,233,585.0000
The price is for reference only, please refer to the actual quotation!

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