XC7K325T-3FFG900E

The XC7K325T-3FFG900E is a high-performance, low-power, programmable logic device manufactured by Xilinx. It is a member of the Kintex-7 family of FPGAs and is optimized for high-speed serial connectivity. The chip features 325,000 logic cells, 1,800 DSP slices, and 900Kbits of block RAM. It also supports up to four independent banks of DDR3 memory.

The device is capable of operating at speeds up to 500MHz, and it is available in a range of packages, including a 676-ball BGA, a 672-ball BGA, and a 636-ball BGA. It has a power consumption of only 6.3W and a maximum operating temperature of 105°C.

The XC7K325T-3FFG900E is ideal for applications that require high-speed data transfer, such as high-performance computing, video/image processing, and networking. It can also be used in applications that require a high degree of flexibility, such as embedded systems, automotive systems, and aerospace systems.

In addition, the device is designed to support the development of custom logic designs, making it suitable for a wide range of applications. It is also compatible with a variety of development tools, including the Xilinx Vivado Design Suite, the Xilinx ISE Design Suite, and the Xilinx SDK.

Overall, the XC7K325T-3FFG900E is a powerful and versatile FPGA that is well-suited for a wide range of applications. It is capable of operating at high speeds, and it offers a low power consumption and a wide range of development tools.