XC7K325T-3FF900E
XC7K325T-3FF900E
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rohs

AMD Xilinx

XC7K325T-3FF900E


XC7K325T-3FF900E
F20-XC7K325T-3FF900E
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS
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XC7K325T-3FF900E ECAD Model


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XC7K325T-3FF900E Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Active
Number of Inputs 500
Number of Outputs 500
Number of Logic Cells 326080
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 1.818 GHz
Power Supplies 1,1.8,3.3 V
JESD-30 Code S-PBGA-B900
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 900
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA900,30X30,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC7K325T-3FF900E Datasheet Download


XC7K325T-3FF900E Overview



The Xilinx XC7K325T-3FF900E is a powerful and versatile field-programmable gate array (FPGA) chip model that is becoming increasingly popular in the technology industry. It is a high-performance FPGA model with a wide range of applications, from consumer electronics to industrial robotics. The XC7K325T-3FF900E is an ideal choice for those who want to take advantage of the latest FPGA technology.


As the demand for high-performance FPGA models increases, the XC7K325T-3FF900E is becoming an increasingly popular choice. This chip model is designed to provide a high level of performance and is capable of running a variety of applications. It is also capable of supporting a wide range of new technologies, such as artificial intelligence (AI) and machine learning (ML). This makes it an ideal choice for those looking to develop and deploy intelligent robots.


In order to take full advantage of the XC7K325T-3FF900E, it is important to understand the product description and specific design requirements. This chip model is designed to provide a high level of performance, but it is important to ensure that the application environment is suitable for the chip model and that the design requirements are met. It is also important to consider the actual case studies and precautions that need to be taken when using the chip model.


In addition, those who are looking to use the XC7K325T-3FF900E effectively will need to have the right technical skills. This includes a good understanding of the application environment and the ability to use the chip model to its full potential. It is also important to have a good understanding of the latest technologies such as AI and ML, as well as the ability to use them effectively.


Overall, the XC7K325T-3FF900E is a powerful and versatile chip model that is becoming increasingly popular in the technology industry. It is capable of supporting a wide range of new technologies, making it an ideal choice for those looking to develop and deploy intelligent robots. In order to take full advantage of the chip model, it is important to understand the product description and specific design requirements, as well as the actual case studies and precautions that need to be taken when using it. Those who are looking to use the XC7K325T-3FF900E effectively will also need to have the right technical skills, including a good understanding of the application environment and the ability to use the chip model to its full potential.



3,129 In Stock


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Unit Price: $2,650.2984
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $2,464.7775 $2,464.7775
10+ $2,438.2745 $24,382.7453
100+ $2,305.7596 $230,575.9608
1000+ $2,173.2447 $1,086,622.3440
10000+ $1,987.7238 $1,987,723.8000
The price is for reference only, please refer to the actual quotation!

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