AMD Xilinx
XC7K325T-3FBG900E
XC7K325T-3FBG900E ECAD Model
XC7K325T-3FBG900E Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 500 | |
| Number of Outputs | 500 | |
| Number of Logic Cells | 326080 | |
| Number of CLBs | 25475 | |
| Combinatorial Delay of a CLB-Max | 580 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 25475 CLBS | |
| Clock Frequency-Max | 1.412 GHz | |
| Power Supplies | 1,1.8,3.3 V | |
| Supply Voltage-Max | 1.03 V | |
| Supply Voltage-Min | 970 mV | |
| JESD-30 Code | S-PBGA-B900 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 2.54 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | FBGA-900 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Pin Count | 900 |
XC7K325T-3FBG900E Datasheet Download
XC7K325T-3FBG900E Overview
The XC7K325T-3FBG900E chip model is a powerful tool that can be used in a variety of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other tasks, and requires the use of HDL language. The chip model is also capable of being used in networks and intelligent scenarios, making it a valuable asset in the era of fully intelligent systems.
The XC7K325T-3FBG900E chip model has a variety of features that make it suitable for a range of tasks. It has a powerful processor core, which is capable of handling complex tasks quickly and efficiently. It also has a range of peripherals, including memory, digital signal processing, and analog-to-digital converters. It also has a wide range of interfaces, allowing it to be connected to other devices.
When using the XC7K325T-3FBG900E chip model, there are a few things to keep in mind. First, it is important to understand the product description and specific design requirements. This will help ensure that the chip model is used correctly and that it is able to perform the tasks it is designed for. Additionally, it is important to consider actual case studies and precautions when using the chip model. This will help ensure that the chip model is used safely and that it is able to perform the tasks it is designed for.
The XC7K325T-3FBG900E chip model is a powerful tool that can be used in a variety of applications. Its wide range of features and capabilities make it suitable for high-performance digital signal processing, embedded processing, image processing, and other tasks. Additionally, its ability to be used in networks and intelligent scenarios make it a valuable asset in the era of fully intelligent systems. It is important to understand the product description and specific design requirements, as well as actual case studies and precautions when using the chip model, in order to ensure that it is used safely and correctly.
You May Also Be Interested In
4,721 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,381.1616 | $1,381.1616 |
| 10+ | $1,366.3104 | $13,663.1040 |
| 100+ | $1,292.0544 | $129,205.4400 |
| 1000+ | $1,217.7984 | $608,899.2000 |
| 10000+ | $1,113.8400 | $1,113,840.0000 |
| The price is for reference only, please refer to the actual quotation! | ||