XC7K325T-3FB900E
XC7K325T-3FB900E
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rohs

AMD Xilinx

XC7K325T-3FB900E


XC7K325T-3FB900E
F20-XC7K325T-3FB900E
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS
XI-2017

XC7K325T-3FB900E ECAD Model


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XC7K325T-3FB900E Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Active
Number of Inputs 500
Number of Outputs 500
Number of Logic Cells 326080
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 1.818 GHz
Power Supplies 1,1.8,3.3 V
JESD-30 Code S-PBGA-B900
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 900
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA900,30X30,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC7K325T-3FB900E Datasheet Download


XC7K325T-3FB900E Overview



The chip model XC7K325T-3FB900E is a powerful and efficient programmable logic device (PLD) designed for various applications in industrial, communication, and other fields. It is a highly integrated FPGA product produced by Xilinx Corporation. It is based on the 28nm process technology and has a large capacity of 3.2 million logic cells, which can provide a large number of logic functions for the user. In addition, it is equipped with a variety of high-speed transceivers, and the maximum operating frequency is up to 900MHz, which can meet the requirements of high-speed data transmission.


In terms of industry trends, the chip model XC7K325T-3FB900E is widely used in various industries. For example, it can be used in industrial control systems, wireless communications, and other fields. In terms of the future development of related industries, the chip model XC7K325T-3FB900E will continue to be used in a wide range of applications, such as in the development of 5G communication networks, the Internet of Things, and artificial intelligence. In addition, it is also possible that the chip model XC7K325T-3FB900E will be used in the development of future advanced communication systems, such as 6G and beyond.


In terms of the original design intention of the chip model XC7K325T-3FB900E and the possibility of future upgrades, the chip model XC7K325T-3FB900E is designed with a wide range of features, including a large capacity of 3.2 million logic cells, high-speed transceivers, and a maximum operating frequency of 900MHz. In addition, it is also designed with the ability to be upgraded by the user, so that it can be used in more advanced applications in the future.


In terms of the possible future applications of the chip model XC7K325T-3FB900E, it can be used in various networks and intelligent scenarios. For example, it can be used in 5G communication networks, the Internet of Things, and artificial intelligence. In addition, it can also be used in the era of fully intelligent systems, such as in the development of autonomous vehicles and smart home systems.


In conclusion, the chip model XC7K325T-3FB900E is a powerful and efficient programmable logic device (PLD) designed for various applications in industrial, communication, and other fields. It has a wide range of features and is designed with the ability to be upgraded by the user, making it suitable for use in a variety of networks and intelligent scenarios. Therefore, it is likely to continue to be widely used in the future, and its application environment may require the support of new technologies.



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