XC7K325T-2FBG900C

The XC7K325T-2FBG900C is a Field Programmable Gate Array (FPGA) chip from the Kintex-7 family manufactured by Xilinx. It is a high-performance, low-power, mid-range FPGA device that is designed to meet the needs of cost-sensitive and power-sensitive applications.

The XC7K325T-2FBG900C features a Kintex-7 family 7-series FPGA fabric with 325K logic cells, 15,360 Kbits of embedded memory, and 1,920 DSP slices. It also has 1,200 I/O pins, with multiple I/O standards, including LVDS, LVCMOS, and SSTL. Furthermore, it has a maximum clock frequency of 650 MHz, a maximum power dissipation of 17W, and a maximum operating temperature of 105 degrees Celsius.

The XC7K325T-2FBG900C is ideal for applications such as industrial automation, medical imaging, video processing, and networking. It is also suitable for applications that require high-performance computing, such as military, aerospace, and automotive. Additionally, it can be used for applications that require low-power, such as portable and battery-powered devices.

Overall, the XC7K325T-2FBG900C is a high-performance, low-power FPGA chip that is suitable for a wide range of applications. It features a Kintex-7 family 7-series FPGA fabric, a maximum clock frequency of 650 MHz, 1,200 I/O pins, and 15,360 Kbits of embedded memory. It is ideal for applications such as industrial automation, medical imaging, video processing, and networking.