AMD Xilinx
XC7K325T-2FB900C
XC7K325T-2FB900C ECAD Model
XC7K325T-2FB900C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 500 | |
| Number of Outputs | 500 | |
| Number of Logic Cells | 326080 | |
| Number of CLBs | 25475 | |
| Combinatorial Delay of a CLB-Max | 610 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 25475 CLBS | |
| Clock Frequency-Max | 1.818 GHz | |
| Power Supplies | 1,1.8,3.3 V | |
| Supply Voltage-Max | 1.03 V | |
| Supply Voltage-Min | 970 mV | |
| JESD-30 Code | S-PBGA-B900 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 2.54 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 | |
| Package Description | FBGA-900 |
XC7K325T-2FB900C Datasheet Download
XC7K325T-2FB900C Overview
The XC7K325T-2FB900C chip model is a groundbreaking advancement in the realm of integrated circuit design. Developed by Xilinx, this model is a highly efficient and powerful system-on-chip (SoC) that boasts a wide range of features and capabilities. It is particularly suited for applications in the fields of communications, data processing, and multimedia.
The XC7K325T-2FB900C chip model features a high-performance, low-power FPGA fabric. It is designed to provide high-speed data processing, with a maximum sustained data rate of up to 900 Mbps. It also has an integrated memory controller, which enables it to support up to 4GB of DDR3 RAM. Additionally, the model features a comprehensive suite of I/O interfaces, including USB, Ethernet, and PCI Express.
The XC7K325T-2FB900C chip model is designed to meet the demands of modern communications systems. Its high-speed capabilities make it ideal for applications such as 5G cellular networks, optical communications, and advanced networking. It can also be used in embedded systems and industrial automation applications. Additionally, the model is designed to be scalable and upgradable, so it can easily be adapted to meet the needs of future applications.
The XC7K325T-2FB900C chip model offers a wide range of features and benefits. It is designed to provide high-speed data processing and low power consumption. It also offers a comprehensive suite of I/O interfaces, allowing it to easily integrate with other components in a system. Additionally, its scalability and upgradability make it a great choice for applications that require future-proofing.
To ensure that the XC7K325T-2FB900C chip model meets the needs of its users, a number of design considerations must be taken into account. These include the power requirements of the system, the data rate requirements, and the I/O interface requirements. Additionally, it is important to consider the environmental conditions in which the chip will be used, as this can have a significant impact on its performance.
The XC7K325T-2FB900C chip model is a powerful and efficient system-on-chip that offers a wide range of features and capabilities. Its high-speed data processing capabilities make it ideal for applications in the fields of communications, data processing, and multimedia. Additionally, its scalability and upgradability make it a great choice for future-proofing applications. With careful consideration of its design requirements, the XC7K325T-2FB900C chip model can be a reliable and powerful asset for any system.
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2,379 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,466.1673 | $1,466.1673 |
| 10+ | $1,450.4021 | $14,504.0208 |
| 100+ | $1,371.5759 | $137,157.5880 |
| 1000+ | $1,292.7497 | $646,374.8400 |
| 10000+ | $1,182.3930 | $1,182,393.0000 |
| The price is for reference only, please refer to the actual quotation! | ||