
AMD Xilinx
XC7K325T-1FFG900CES
XC7K325T-1FFG900CES ECAD Model
XC7K325T-1FFG900CES Attributes
Type | Description | Select |
---|---|---|
Mfr | AMD Xilinx | |
Series | Kintex®-7 | |
Package | Tray | |
Number of LABs/CLBs | 25475 | |
Number of Logic Elements/Cells | 326080 | |
Total RAM Bits | 16404480 | |
Number of I/O | 500 | |
Voltage - Supply | 0.97V ~ 1.03V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
Package / Case | 900-BBGA, FCBGA | |
Supplier Device Package | 900-FCBGA (31x31) | |
Base Product Number | XC7K325T |
XC7K325T-1FFG900CES Datasheet Download
XC7K325T-1FFG900CES Overview
The XC7K325T-1FFG900CES is an FPGA (Field Programmable Gate Array) chip model manufactured by Xilinx. It is a member of the Kintex-7 family of FPGAs and is built on a 28nm process. It has 1,536 logic cells, 1.5Mb of block RAM, and 900Kb of distributed RAM. The chip has 8 transceivers, each with a data rate of up to 12.5Gbps, and supports a wide range of I/O standards. It also has a number of clock management features and power management features.
The XC7K325T-1FFG900CES is designed for a variety of applications, including high-speed communication, industrial automation, aerospace and defense, and video and imaging. It is well-suited for applications that require high throughput, low latency, and high reliability, such as 5G networks, data centers, and autonomous vehicles. The chip is also suitable for use in applications that require high-speed data transfer, such as video and image processing, high-speed networking, and storage.
The XC7K325T-1FFG900CES is a reliable, high-performance FPGA chip that offers a wide range of features and capabilities. It is designed for use in a variety of applications, from high-speed communication to industrial automation and aerospace and defense. It is well-suited for applications that require high throughput, low latency, and high reliability.
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Pricing (USD)
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