XC7A35T-3CPG236E
XC7A35T-3CPG236E
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rohs

AMD Xilinx

XC7A35T-3CPG236E


XC7A35T-3CPG236E
F20-XC7A35T-3CPG236E
Active
FIELD PROGRAMMABLE GATE ARRAY, LFBGA, BGA236,19X19,20
LFBGA, BGA236,19X19,20

XC7A35T-3CPG236E ECAD Model


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XC7A35T-3CPG236E Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 1 V
Number of Inputs 250
Number of Outputs 250
Number of Logic Cells 33280
Number of CLBs 2600
Combinatorial Delay of a CLB-Max 940 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Organization 2600 CLBS
Clock Frequency-Max 1.412 GHz
Power Supplies 1 V
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B236
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 236
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA236,19X19,20
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 500 µm
Terminal Position BOTTOM
Width 10 mm
Length 10 mm
Seated Height-Max 1.38 mm
Ihs Manufacturer XILINX INC
Package Description LFBGA, BGA236,19X19,20
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Part Package Code BGA
Pin Count 236

XC7A35T-3CPG236E Datasheet Download


XC7A35T-3CPG236E Overview



XC7A35T-3CPG236E is a powerful chip model that is designed to provide high-performance digital signal processing, embedded processing, and image processing. It is a Field Programmable Gate Array (FPGA) that is built on Xilinx 7-series architecture and requires the use of HDL language.


The original design intention of the chip model XC7A35T-3CPG236E is to provide a highly versatile solution for applications that require high-performance digital signal processing, embedded processing, and image processing. It is designed with the capability to be upgraded in the future, allowing for greater flexibility and scalability. It also has the potential to be used for advanced communication systems, although this may require additional development and design.


The product description of XC7A35T-3CPG236E includes its features such as a high-performance digital signal processor, embedded processor, and image processor. It also has a wide range of features such as a high-speed transceiver, high-speed I/O, and a low-power design. In addition, it has a range of memory options, including DDR3, QDRII+, and RLDRAM3.


The design requirements of the XC7A35T-3CPG236E chip model include the use of HDL language, a detailed understanding of the architecture, and the ability to configure the FPGA correctly. Additionally, it is important to ensure that the chip model is correctly configured for the specific application, as this will ensure that the chip model works as expected.


To ensure a successful implementation of the XC7A35T-3CPG236E chip model, there are a few precautions that should be taken. First, it is important to ensure that the HDL language is correctly used, as this will ensure that the chip model is correctly configured. Additionally, it is important to ensure that the chip model is correctly configured for the specific application, as this will ensure that the chip model works as expected.


To provide further insight into the application of the XC7A35T-3CPG236E chip model, a few case studies can be used. For example, it has been used in the development of a high-performance digital signal processor for a medical device. Additionally, it has been used in the development of an image processing system for a security camera system. These case studies provide a good example of the capabilities of the XC7A35T-3CPG236E chip model and how it can be used in various applications.


In conclusion, the XC7A35T-3CPG236E chip model is a powerful solution for applications that require high-performance digital signal processing, embedded processing, and image processing. It is designed with the capability to be upgraded in the future, allowing for greater flexibility and scalability. To ensure a successful implementation of the XC7A35T-3CPG236E chip model, it is important to ensure that the HDL language is correctly used, that the chip model is correctly configured for the specific application, and that the necessary precautions are taken. Case studies can be used to provide further insight into the application of the XC7A35T-3CPG236E chip model.



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Pricing (USD)

QTY Unit Price Ext Price
1+ $45.3096 $45.3096
10+ $44.8224 $448.2240
100+ $42.3864 $4,238.6400
1000+ $39.9504 $19,975.2000
10000+ $36.5400 $36,540.0000
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