
AMD Xilinx
XC7A35T-3CPG236E
XC7A35T-3CPG236E ECAD Model
XC7A35T-3CPG236E Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 250 | |
Number of Outputs | 250 | |
Number of Logic Cells | 33280 | |
Number of CLBs | 2600 | |
Combinatorial Delay of a CLB-Max | 940 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Organization | 2600 CLBS | |
Clock Frequency-Max | 1.412 GHz | |
Power Supplies | 1 V | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B236 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 236 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA236,19X19,20 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 500 µm | |
Terminal Position | BOTTOM | |
Width | 10 mm | |
Length | 10 mm | |
Seated Height-Max | 1.38 mm | |
Ihs Manufacturer | XILINX INC | |
Package Description | LFBGA, BGA236,19X19,20 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Part Package Code | BGA | |
Pin Count | 236 |
XC7A35T-3CPG236E Datasheet Download
XC7A35T-3CPG236E Overview
XC7A35T-3CPG236E is a powerful chip model that is designed to provide high-performance digital signal processing, embedded processing, and image processing. It is a Field Programmable Gate Array (FPGA) that is built on Xilinx 7-series architecture and requires the use of HDL language.
The original design intention of the chip model XC7A35T-3CPG236E is to provide a highly versatile solution for applications that require high-performance digital signal processing, embedded processing, and image processing. It is designed with the capability to be upgraded in the future, allowing for greater flexibility and scalability. It also has the potential to be used for advanced communication systems, although this may require additional development and design.
The product description of XC7A35T-3CPG236E includes its features such as a high-performance digital signal processor, embedded processor, and image processor. It also has a wide range of features such as a high-speed transceiver, high-speed I/O, and a low-power design. In addition, it has a range of memory options, including DDR3, QDRII+, and RLDRAM3.
The design requirements of the XC7A35T-3CPG236E chip model include the use of HDL language, a detailed understanding of the architecture, and the ability to configure the FPGA correctly. Additionally, it is important to ensure that the chip model is correctly configured for the specific application, as this will ensure that the chip model works as expected.
To ensure a successful implementation of the XC7A35T-3CPG236E chip model, there are a few precautions that should be taken. First, it is important to ensure that the HDL language is correctly used, as this will ensure that the chip model is correctly configured. Additionally, it is important to ensure that the chip model is correctly configured for the specific application, as this will ensure that the chip model works as expected.
To provide further insight into the application of the XC7A35T-3CPG236E chip model, a few case studies can be used. For example, it has been used in the development of a high-performance digital signal processor for a medical device. Additionally, it has been used in the development of an image processing system for a security camera system. These case studies provide a good example of the capabilities of the XC7A35T-3CPG236E chip model and how it can be used in various applications.
In conclusion, the XC7A35T-3CPG236E chip model is a powerful solution for applications that require high-performance digital signal processing, embedded processing, and image processing. It is designed with the capability to be upgraded in the future, allowing for greater flexibility and scalability. To ensure a successful implementation of the XC7A35T-3CPG236E chip model, it is important to ensure that the HDL language is correctly used, that the chip model is correctly configured for the specific application, and that the necessary precautions are taken. Case studies can be used to provide further insight into the application of the XC7A35T-3CPG236E chip model.
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3,773 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $45.3096 | $45.3096 |
10+ | $44.8224 | $448.2240 |
100+ | $42.3864 | $4,238.6400 |
1000+ | $39.9504 | $19,975.2000 |
10000+ | $36.5400 | $36,540.0000 |
The price is for reference only, please refer to the actual quotation! |