XC7A100T-L2CSG324E
XC7A100T-L2CSG324E
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AMD Xilinx

XC7A100T-L2CSG324E


XC7A100T-L2CSG324E
F20-XC7A100T-L2CSG324E
Active
IC FPGA 210 I/O 324CSBGA
324-CSPBGA (15x15)

XC7A100T-L2CSG324E ECAD Model


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XC7A100T-L2CSG324E Attributes


Type Description Select
Mfr AMD Xilinx
Series Artix-7
Package Tray
Number of LABs/CLBs 7925
Number of Logic Elements/Cells 101440
Total RAM Bits 4976640
Number of I/O 210
Voltage - Supply 0.95V ~ 1.05V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 100°C (TJ)
Package / Case 324-LFBGA, CSPBGA
Supplier Device Package 324-CSPBGA (15x15)
Base Product Number XC7A100

XC7A100T-L2CSG324E Datasheet Download


XC7A100T-L2CSG324E Overview



The XC7A100T-L2CSG324E is a Field Programmable Gate Array (FPGA) chip developed by Xilinx. It is a member of the 7-series of FPGAs and is based on the Artix-7 architecture. It is a mid-range FPGA and is ideal for cost-sensitive applications.


The XC7A100T-L2CSG324E has a total of 100K logic cells, with up to 576Kbits of block RAM and up to 9,152Kbits of distributed RAM. It has up to 8 DSP slices, providing up to 48 GMACs of DSP performance. It has up to 352 I/O pins and up to four clock management tiles, providing up to 8 global clock networks.


The XC7A100T-L2CSG324E is designed for high-performance applications such as video and image processing, high-speed serial connectivity, and high-speed embedded computing. It is also suitable for low-power applications such as embedded systems, wireless systems, and industrial control.


The XC7A100T-L2CSG324E has an operating temperature range of -40°C to +85°C, and is available in a 324-pin Flip-Chip BGA package. It is also available in a range of densities, from XC7A100T-L2CSG324E to XC7A200T-L2CSG324E.


In summary, the XC7A100T-L2CSG324E is a mid-range FPGA chip developed by Xilinx, based on the Artix-7 architecture. It is ideal for cost-sensitive applications and is suitable for high-performance and low-power applications. It has a total of 100K logic cells, up to 576Kbits of block RAM, up to 9,152Kbits of distributed RAM, up to 8 DSP slices, up to 352 I/O pins, and up to four clock management tiles. It is available in a 324-pin Flip-Chip BGA package, with an operating temperature range of -40°C to +85°C.



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Unit Price: $195.8849
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Pricing (USD)

QTY Unit Price Ext Price
1+ $182.1730 $182.1730
10+ $180.2141 $1,802.1411
100+ $170.4199 $17,041.9863
1000+ $160.6256 $80,312.8090
10000+ $146.9137 $146,913.6750
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