
AMD Xilinx
XC7372-7WC84C
XC7372-7WC84C ECAD Model
XC7372-7WC84C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Propagation Delay | 18.5 ns | |
Number of Dedicated Inputs | 12 | |
Number of Macro Cells | 72 | |
Number of I/O Lines | 37 | |
Programmable Logic Type | UV PLD | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 12 DEDICATED INPUTS, 37 I/O | |
Additional Feature | 72 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 3 EXTERNAL CLOCKS; 126 FLIP-FLOPS... more | |
Clock Frequency-Max | 95.2 MHz | |
In-System Programmable | NO | |
JTAG BST | NO | |
Output Function | MACROCELL | |
Power Supplies | 3.3/5,5 V | |
Supply Voltage-Max | 5.25 V | |
Supply Voltage-Min | 4.75 V | |
JESD-30 Code | S-CQCC-J84 | |
Qualification Status | Not Qualified | |
Moisture Sensitivity Level | 1 | |
Operating Temperature-Max | 70 °C | |
Number of Terminals | 84 | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | WQCCJ | |
Package Equivalence Code | LDCC84,1.2SQ | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER, WINDOW | |
Surface Mount | YES | |
Terminal Form | J BEND | |
Terminal Pitch | 1.27 mm | |
Terminal Position | QUAD | |
Width | 29.21 mm | |
Length | 29.21 mm | |
Seated Height-Max | 4.826 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | LCC | |
Package Description | WQCCJ, LDCC84,1.2SQ | |
Pin Count | 84 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 |
XC7372-7WC84C Datasheet Download
XC7372-7WC84C Overview
The XC7372-7WC84C chip model is a powerful, high-performance digital signal processing, embedded processing, and image processing tool. Developed by Xilinx, it is an ideal solution for advanced communication systems. It is designed to provide users with a flexible, efficient and cost-effective platform for their projects.
The XC7372-7WC84C chip model is based on the Virtex-7 family of FPGAs. It is designed to deliver high-performance, low-power capabilities with support for the latest in high-speed memory and communication protocols. It features a wide range of programmable logic resources, high-performance DSP blocks, and a high-speed transceiver for fast data transfer. It is also equipped with a variety of high-speed I/O interfaces, including PCIe, USB, and Ethernet.
The XC7372-7WC84C chip model can be programmed using the HDL (Hardware Description Language) language. This allows users to easily create and modify designs to suit their specific needs. The chip model is also designed to be easily upgradable, allowing users to easily expand their system as their project requirements change.
The XC7372-7WC84C chip model is an ideal choice for applications such as digital signal processing, embedded processing, and image processing. It is also suitable for applications involving advanced communication systems. It is designed to provide users with a cost-effective and efficient platform for their projects.
When using the XC7372-7WC84C chip model, users should be aware of the design requirements and product specifications. It is important to ensure that the design meets the requirements of the application and the system. Additionally, users should also be aware of the potential risks associated with using the chip model and should take appropriate precautions.
Case studies can be a useful resource for understanding how the XC7372-7WC84C chip model can be used in various applications. By looking at successful projects, users can learn more about the capabilities of the chip model and how it can be applied to their own projects.
The XC7372-7WC84C chip model is a powerful, high-performance tool for digital signal processing, embedded processing, and image processing. It is designed to provide users with a cost-effective and efficient platform for their projects. It is also easily upgradable and can be programmed using the HDL language. When using the chip model, users should be aware of the design requirements and product specifications, as well as the potential risks associated with using the chip model. Case studies can also be a useful resource for understanding how the XC7372-7WC84C chip model can be used in various applications.
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