AMD Xilinx
XC7372-15PQ100C
XC7372-15PQ100C ECAD Model
XC7372-15PQ100C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Propagation Delay | 33 ns | |
| Number of Dedicated Inputs | 12 | |
| Number of Macro Cells | 72 | |
| Number of I/O Lines | 42 | |
| Programmable Logic Type | OT PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | RECTANGULAR | |
| Technology | CMOS | |
| Organization | 12 DEDICATED INPUTS, 42 I/O | |
| Additional Feature | 72 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 3 EXTERNAL CLOCKS; 126 FLIP-FLOPS... more | |
| Clock Frequency-Max | 52.6 MHz | |
| In-System Programmable | NO | |
| JTAG BST | NO | |
| Output Function | MACROCELL | |
| Power Supplies | 3.3/5,5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | R-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP100,.7X.9 | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 20 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-100 | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC7372-15PQ100C Datasheet Download
XC7372-15PQ100C Overview
The XC7372-15PQ100C chip model is a cutting-edge technology developed by Xilinx, Inc. It is a high-performance, low-power, and cost-effective FPGA chip with a wide range of applications in various industries. This chip model is designed to meet the increasing demand for high-speed data processing and communication in today's digital world.
The XC7372-15PQ100C chip model is equipped with a wide range of features, including a high-speed transceiver, an advanced logic array, and a low-power architecture. It also provides multiple clock domains, a wide range of power modes, and an integrated memory controller. These features make the chip model ideal for a variety of applications, including high-speed data processing, communication, and multimedia.
The XC7372-15PQ100C chip model offers many advantages over traditional FPGA chips. It is designed to provide high-speed data processing and communication capabilities with low power consumption. The chip model is also designed to be highly reliable, with a long lifetime and low failure rate. Additionally, the chip model is designed to be highly scalable, allowing for easy upgrades and modifications.
The XC7372-15PQ100C chip model is expected to have a strong demand in the coming years, as more and more industries are turning to digital solutions. This chip model is well suited for a variety of applications, from high-speed data processing and communication to multimedia and advanced communication systems. The original design intention of the chip model was to provide a low-power, cost-effective, and reliable solution for a variety of applications.
The XC7372-15PQ100C chip model is also designed to be upgradable, allowing for future upgrades and modifications. This makes the chip model a great choice for applications that require the support of new technologies, as it can be easily adapted to new technologies. Additionally, the chip model is designed to be compatible with advanced communication systems, making it a great choice for applications that require high-speed data processing and communication.
Overall, the XC7372-15PQ100C chip model is a great choice for a variety of applications, from high-speed data processing and communication to multimedia and advanced communication systems. It is designed to provide a low-power, cost-effective, and reliable solution, and it is also designed to be upgradable and compatible with advanced communication systems. As such, the chip model is expected to have a strong demand in the coming years, and it is well suited for a variety of applications.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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