
AMD Xilinx
XC7372-12WC84C
XC7372-12WC84C ECAD Model
XC7372-12WC84C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Propagation Delay | 28 ns | |
Number of Dedicated Inputs | 12 | |
Number of Macro Cells | 72 | |
Number of I/O Lines | 37 | |
Programmable Logic Type | UV PLD | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 12 DEDICATED INPUTS, 37 I/O | |
Additional Feature | 72 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 3 EXTERNAL CLOCKS; 126 FLIP-FLOPS... more | |
Clock Frequency-Max | 62.5 MHz | |
In-System Programmable | NO | |
JTAG BST | NO | |
Output Function | MACROCELL | |
Power Supplies | 3.3/5,5 V | |
Supply Voltage-Max | 5.25 V | |
Supply Voltage-Min | 4.75 V | |
JESD-30 Code | S-CQCC-J84 | |
Qualification Status | Not Qualified | |
Moisture Sensitivity Level | 1 | |
Operating Temperature-Max | 70 °C | |
Number of Terminals | 84 | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | WQCCJ | |
Package Equivalence Code | LDCC84,1.2SQ | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER, WINDOW | |
Surface Mount | YES | |
Terminal Form | J BEND | |
Terminal Pitch | 1.27 mm | |
Terminal Position | QUAD | |
Width | 29.21 mm | |
Length | 29.21 mm | |
Seated Height-Max | 4.826 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | LCC | |
Package Description | WQCCJ, LDCC84,1.2SQ | |
Pin Count | 84 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 |
XC7372-12WC84C Datasheet Download
XC7372-12WC84C Overview
The XC7372-12WC84C chip model is an advanced integrated circuit (IC) designed by Xilinx Inc. It is a high-performance programmable logic device that is capable of being upgraded and used in advanced communication systems. The XC7372-12WC84C is a flexible and powerful chip that can be used in a variety of applications.
The XC7372-12WC84C is a powerful chip that can be used in a wide range of applications and networks. It is capable of being used in advanced communication systems, such as the Internet of Things (IoT), 5G networks, and the upcoming 6G networks. It can also be applied to intelligent scenarios such as autonomous vehicles, robotics, and smart homes. Furthermore, it can be used in the era of fully intelligent systems that are powered by artificial intelligence (AI) and machine learning (ML).
The XC7372-12WC84C is designed to meet a variety of needs. It has a wide range of features, including high performance, low power consumption, and low latency. It also has a large number of I/O pins, which allows for easy integration into various systems. Furthermore, the chip is designed to be highly configurable, allowing for easy customization to meet specific requirements.
In addition to its impressive features, the XC7372-12WC84C also has a number of case studies and precautions that should be considered when using the chip. For example, the chip should be properly shielded from electromagnetic interference, as this can cause the chip to malfunction. Furthermore, the chip should be properly cooled to ensure that it does not overheat. Finally, the chip should be properly tested and verified to ensure that it meets all of the desired performance requirements.
In conclusion, the XC7372-12WC84C is a powerful and flexible chip that can be used in a variety of applications and networks. It is capable of being upgraded and used in advanced communication systems, as well as being applied to intelligent scenarios such as autonomous vehicles and robotics. Furthermore, it is designed to be highly configurable, allowing for easy customization to meet specific requirements. Finally, there are a number of case studies and precautions that should be considered when using the chip.
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