
AMD Xilinx
XC7372-10PQ100C
XC7372-10PQ100C ECAD Model
XC7372-10PQ100C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Propagation Delay | 23 ns | |
Number of Dedicated Inputs | 12 | |
Number of Macro Cells | 72 | |
Number of I/O Lines | 42 | |
Programmable Logic Type | OT PLD | |
Temperature Grade | COMMERCIAL | |
Package Shape | RECTANGULAR | |
Technology | CMOS | |
Organization | 12 DEDICATED INPUTS, 42 I/O | |
Additional Feature | 72 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 3 EXTERNAL CLOCKS; 126 FLIP-FLOPS... more | |
Clock Frequency-Max | 71.4 MHz | |
In-System Programmable | NO | |
JTAG BST | NO | |
Output Function | MACROCELL | |
Power Supplies | 3.3/5,5 V | |
Supply Voltage-Max | 5.25 V | |
Supply Voltage-Min | 4.75 V | |
JESD-30 Code | R-PQFP-G100 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 70 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 100 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QFP | |
Package Equivalence Code | QFP100,.7X.9 | |
Package Shape | RECTANGULAR | |
Package Style | FLATPACK | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | GULL WING | |
Terminal Pitch | 650 µm | |
Terminal Position | QUAD | |
Width | 14 mm | |
Length | 20 mm | |
Seated Height-Max | 3.4 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | PLASTIC, QFP-100 | |
Pin Count | 100 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC7372-10PQ100C Datasheet Download
XC7372-10PQ100C Overview
The chip model XC7372-10PQ100C is a high-performance, low-power, low-cost FPGA from Xilinx. It has been widely used in the fields of embedded systems, industrial control, and communication networks. As the industry continues to develop, the chip model XC7372-10PQ100C is becoming increasingly popular.
In order to better understand the industry trends and future development of the chip model XC7372-10PQ100C, it is important to understand its product description and design requirements. The chip model XC7372-10PQ100C is an FPGA with a total of 100 logic cells, and it has a power consumption of less than 10 Watts. It also has a wide range of I/O, including GPIO, SPI, I2C, and UART. Additionally, it supports a variety of development tools, including Vivado Design Suite, Vivado HLS, and Xilinx SDK.
In terms of application environment, the chip model XC7372-10PQ100C can be used in a variety of scenarios. For example, it can be used in the development of intelligent robots, as it provides a powerful platform for the development of advanced algorithms and applications. It can also be used in industrial control, communication networks, and embedded systems. In order to effectively use the chip model XC7372-10PQ100C, it is important to have a good understanding of the product description, design requirements, and development tools.
In terms of technical talents, the chip model XC7372-10PQ100C requires expertise in FPGA design, embedded systems, and software development. Knowledge of microprocessors and digital signal processing is also important for effective use of the chip model. Additionally, experience in programming languages such as Verilog and VHDL is also necessary.
Finally, it is important to note that the chip model XC7372-10PQ100C is a powerful and versatile FPGA that can be used in a variety of applications. In order to make the most of the chip model, it is important to have a good understanding of its product description, design requirements, and development tools. Additionally, technical expertise in FPGA design, embedded systems, and software development is also necessary. With these in mind, the chip model XC7372-10PQ100C can be effectively used in the development and popularization of future intelligent robots.
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