AMD Xilinx
XC7372-10PC84I
XC7372-10PC84I ECAD Model
XC7372-10PC84I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Propagation Delay | 23 ns | |
| Number of Dedicated Inputs | 12 | |
| Number of Macro Cells | 72 | |
| Number of I/O Lines | 37 | |
| Programmable Logic Type | OT PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 12 DEDICATED INPUTS, 37 I/O | |
| Additional Feature | 72 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 3 EXTERNAL CLOCKS; 126 FLIP-FLOPS... more | |
| Clock Frequency-Max | 71.4 MHz | |
| In-System Programmable | NO | |
| JTAG BST | NO | |
| Output Function | MACROCELL | |
| Power Supplies | 3.3/5,5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-PQCC-J84 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 84 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Equivalence Code | LDCC84,1.2SQ | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Width | 29.3116 mm | |
| Length | 29.3116 mm | |
| Seated Height-Max | 5.08 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | LCC | |
| Package Description | PLASTIC, LCC-84 | |
| Pin Count | 84 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC7372-10PC84I Datasheet Download
XC7372-10PC84I Overview
The XC7372-10PC84I chip model is a powerful device that is suitable for high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language for its application environment. This chip model has the potential to be applied to a variety of industries and scenarios.
The XC7372-10PC84I is a versatile chip that can be used in a variety of applications. It is particularly useful for high-performance digital signal processing and embedded processing, as well as image processing. It is capable of handling a wide range of tasks, making it suitable for a variety of scenarios. It also requires the use of HDL language for its application environment.
The industry trends of the chip model XC7372-10PC84I and the future development of related industries will depend on what specific technologies are needed. As technology continues to evolve, new technologies may be required to support the application environment of the chip model.
The XC7372-10PC84I is also suitable for networks and intelligent scenarios. It can be used in the era of fully intelligent systems, as it is capable of handling a wide range of tasks. It can be used to power a variety of intelligent systems, such as self-driving cars, smart homes, and voice-activated devices.
Overall, the XC7372-10PC84I chip model is a powerful device that is suitable for a variety of applications. It requires the use of HDL language for its application environment and can be used in networks and intelligent scenarios. The industry trends of the chip model and the future development of related industries will depend on what specific technologies are needed. As technology continues to evolve, new technologies may be required to support the application environment of the chip model.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||