
AMD Xilinx
XC7336Q-12PC44I
XC7336Q-12PC44I ECAD Model
XC7336Q-12PC44I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Propagation Delay | 19 ns | |
Number of Dedicated Inputs | 2 | |
Number of Macro Cells | 36 | |
Number of I/O Lines | 32 | |
Programmable Logic Type | OT PLD | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 2 DEDICATED INPUTS, 32 I/O | |
Additional Feature | 36 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 2 EXTERNAL CLOCKS; 36 FLIP-FLOPS... more | |
Clock Frequency-Max | 80 MHz | |
In-System Programmable | NO | |
JTAG BST | NO | |
Output Function | MACROCELL | |
Power Supplies | 3.3/5,5 V | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 4.5 V | |
JESD-30 Code | S-PQCC-J44 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 44 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QCCJ | |
Package Equivalence Code | LDCC44,.7SQ | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | J BEND | |
Terminal Pitch | 1.27 mm | |
Terminal Position | QUAD | |
Width | 16.5862 mm | |
Length | 16.5862 mm | |
Seated Height-Max | 4.57 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | LCC | |
Package Description | PLASTIC, LCC-44 | |
Pin Count | 44 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC7336Q-12PC44I Datasheet Download
XC7336Q-12PC44I Overview
The XC7336Q-12PC44I chip model is a powerful integrated circuit designed to meet the needs of modern communication systems. It is a low-power, high-performance, and cost-effective solution that can be used in a variety of applications, such as base stations, routers, and switches. The design intention of this chip model is to provide users with a reliable and efficient communication system.
The XC7336Q-12PC44I chip model offers a wide range of features to support advanced communication systems. It features a high-speed, low-power, and low-cost design that is ideal for applications that require high data throughput and low latency. The chip supports multiple communication protocols such as Ethernet, Wi-Fi, Bluetooth, and LTE. It also supports a variety of media formats such as audio, video, and data.
The XC7336Q-12PC44I chip model is designed to be easily upgradable in the future. It is designed with a modular architecture that allows for easy integration of new features and technologies. This makes it an ideal choice for applications that require frequent upgrades or require support for new technologies.
The XC7336Q-12PC44I chip model can be used in a variety of intelligent scenarios. It can be used to power smart home systems, connected cars, and industrial automation systems. It can also be used in the era of fully intelligent systems, such as artificial intelligence and machine learning.
The product description of the XC7336Q-12PC44I chip model includes its size, power consumption, operating temperature range, and other specifications. It is designed to meet specific design requirements, such as low power consumption, low latency, high data throughput, and high reliability. The chip also supports multiple communication protocols and media formats.
There are several case studies available that demonstrate the effectiveness of the XC7336Q-12PC44I chip model in various applications. These case studies provide an insight into the performance of the chip model and how it can be used in various scenarios. It is important to note that the chip model should be used with caution and care in order to ensure optimal performance.
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