AMD Xilinx
XC7336Q-10PC44C
XC7336Q-10PC44C ECAD Model
XC7336Q-10PC44C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Propagation Delay | 15 ns | |
| Number of Dedicated Inputs | 2 | |
| Number of Macro Cells | 36 | |
| Number of I/O Lines | 32 | |
| Programmable Logic Type | OT PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2 DEDICATED INPUTS, 32 I/O | |
| Additional Feature | 36 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 2 EXTERNAL CLOCKS; 36 FLIP-FLOPS... more | |
| Clock Frequency-Max | 100 MHz | |
| In-System Programmable | NO | |
| JTAG BST | NO | |
| Output Function | MACROCELL | |
| Power Supplies | 3.3/5,5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQCC-J44 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 44 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Equivalence Code | LDCC44,.7SQ | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Width | 16.5862 mm | |
| Length | 16.5862 mm | |
| Seated Height-Max | 4.57 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | LCC | |
| Package Description | PLASTIC, LCC-44 | |
| Pin Count | 44 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC7336Q-10PC44C Datasheet Download
XC7336Q-10PC44C Overview
The XC7336Q-10PC44C chip model is a high-performance, low-power, and highly integrated chip model developed by Xilinx. It has a wide range of applications in the field of network communication, and its original design intention is to provide a comprehensive solution for many communication systems.
The XC7336Q-10PC44C chip model integrates a variety of communication technologies and features, such as Ethernet, USB, SATA, PCIe, and DDR3, into a single chip. This makes it an ideal choice for advanced communication systems. It also supports the latest network protocols, such as IPv6, allowing it to be used in a wide range of applications.
In addition, the XC7336Q-10PC44C chip model is designed to be highly scalable and upgradable. This means that it can easily be adapted to the latest technologies, allowing it to be used in the era of fully intelligent systems. It can be used to build intelligent networks and scenarios, such as smart homes, smart cities, and autonomous vehicles.
The XC7336Q-10PC44C chip model also has a number of specific design requirements. The chip model requires a minimum operating voltage of 1.2V and a maximum operating temperature of 105°C. It also has a maximum power consumption of 10W.
In order to ensure the performance and reliability of the XC7336Q-10PC44C chip model, it is important to follow the design requirements and guidelines provided by Xilinx. For example, it is important to ensure that the operating temperature does not exceed the specified maximum temperature, and that the power consumption is kept within the specified maximum power consumption.
Case studies of the XC7336Q-10PC44C chip model have demonstrated its effectiveness in various applications. For example, it has been used in the development of a smart home system, where it was used to control various home appliances. It has also been used in the development of an autonomous vehicle, where it was used to control the vehicle's navigation and other functions.
In conclusion, the XC7336Q-10PC44C chip model is a highly versatile and powerful chip model that can be used in a wide range of applications. Its original design intention was to provide a comprehensive solution for many communication systems, and its scalability and upgradability make it suitable for use in the era of fully intelligent systems. Furthermore, its specific design requirements must be followed in order to ensure its performance and reliability. Case studies have demonstrated its effectiveness in various applications, and it is an ideal choice for advanced communication systems.
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