AMD Xilinx
XC73108-15PQ160C
XC73108-15PQ160C ECAD Model
XC73108-15PQ160C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Propagation Delay | 36 ns | |
| Number of Dedicated Inputs | 12 | |
| Number of Macro Cells | 108 | |
| Number of I/O Lines | 78 | |
| Programmable Logic Type | OT PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 12 DEDICATED INPUTS, 78 I/O | |
| Additional Feature | 108 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 3 EXTERNAL CLOCKS; 198 FLIP-FLOPS... more | |
| Clock Frequency-Max | 45.5 MHz | |
| In-System Programmable | NO | |
| JTAG BST | NO | |
| Output Function | MACROCELL | |
| Power Supplies | 3.3/5,5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G160 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 160 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP160,1.2SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-160 | |
| Pin Count | 160 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC73108-15PQ160C Datasheet Download
XC73108-15PQ160C Overview
The chip model XC73108-15PQ160C is a new type of semiconductor device developed by Xilinx, Inc. It is a programmable logic device (PLD) with a wide range of applications in the fields of communication, computing, and robotics. It is designed to provide high-performance, cost-effective solutions for customers to build sophisticated systems and products.
The XC73108-15PQ160C chip model offers a number of advantages. It is highly compatible with the latest communication standards, allowing for easy integration with existing systems. It supports a variety of I/O protocols, making it suitable for a wide range of applications. The chip also provides a high-speed data transmission rate, allowing for faster data transfer. Additionally, the chip is designed with a low power consumption, making it more energy-efficient.
The demand for the XC73108-15PQ160C chip model is expected to increase in the future, as more industries adopt advanced communication systems. This chip model can be used in a variety of projects, including industrial automation, automotive, medical, and consumer electronics. It is also expected to be used in the development of intelligent robots, as it is capable of providing high-speed data transmission and support for a wide range of I/O protocols.
The original design intention of the XC73108-15PQ160C chip model was to provide a cost-effective solution for customers to build sophisticated systems and products. The chip is highly customizable and can be used for a variety of applications. It is also designed with the possibility of future upgrades, allowing customers to upgrade their systems as new technologies emerge.
The XC73108-15PQ160C chip model can be applied to the development and popularization of future intelligent robots, as it is capable of providing high-speed data transmission and support for a wide range of I/O protocols. However, it is important to note that the chip model requires technical expertise to be used effectively. An understanding of the various I/O protocols and the ability to program the chip are essential for successful implementation.
Overall, the XC73108-15PQ160C chip model is a highly customizable and cost-effective solution for customers to build sophisticated systems and products. Its compatibility with the latest communication standards, high-speed data transmission rate, and low power consumption make it a suitable choice for a variety of applications, including the development and popularization of future intelligent robots. Technical expertise is needed to use the chip model effectively, but the possibility of future upgrades makes it an attractive choice for customers.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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