AMD Xilinx
XC73108-12PQ160C
XC73108-12PQ160C ECAD Model
XC73108-12PQ160C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Propagation Delay | 30 ns | |
| Number of Dedicated Inputs | 12 | |
| Number of Macro Cells | 108 | |
| Number of I/O Lines | 78 | |
| Programmable Logic Type | OT PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 12 DEDICATED INPUTS, 78 I/O | |
| Additional Feature | 108 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 3 EXTERNAL CLOCKS; 198 FLIP-FLOPS... more | |
| Clock Frequency-Max | 55.6 MHz | |
| In-System Programmable | NO | |
| JTAG BST | NO | |
| Output Function | MACROCELL | |
| Power Supplies | 3.3/5,5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G160 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 160 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP160,1.2SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 650 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-160 | |
| Pin Count | 160 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC73108-12PQ160C Datasheet Download
XC73108-12PQ160C Overview
The XC73108-12PQ160C chip model is a highly advanced and powerful model with a variety of applications in the networking industry. It is a multi-functional chip model that is designed to meet the needs of both industrial and consumer applications. It offers a wide range of features, including high-speed data transfer, low power consumption, and a wide range of integrated functions.
The XC73108-12PQ160C chip model has several advantages over other models in the market. Firstly, it has a high speed data transfer rate of up to 12Gbps, which is ideal for high-performance applications such as streaming video, gaming, and other high-bandwidth activities. Secondly, it has a low power consumption rate, which makes it suitable for a wide range of applications, such as mobile devices, embedded systems, and other low-power applications. Thirdly, it has a wide range of integrated functions, such as support for multiple protocols, support for multiple operating systems, and support for multiple languages.
The XC73108-12PQ160C chip model is expected to be in high demand in the future, due to its versatile features and its ability to meet the needs of a wide range of applications. It is expected to be used in a variety of scenarios, including the Internet of Things (IoT), home automation, and other intelligent connectivity applications. It is also expected to be used in the era of fully intelligent systems, such as autonomous cars and smart homes.
The XC73108-12PQ160C chip model has a product description and specific design requirements, which must be met in order to ensure that the chip works properly. The chip comes with a wide range of features, such as support for multiple protocols, support for multiple operating systems, and support for multiple languages. It also has a wide range of integrated functions, such as support for multiple protocols, support for multiple operating systems, and support for multiple languages.
In addition, there are several case studies and precautions that must be taken into consideration when using the XC73108-12PQ160C chip model. For example, the chip must be tested to ensure that it is compatible with the system that it is being used in, and that it meets all the design requirements. Furthermore, it is important to ensure that the chip is properly configured and that all the necessary drivers and software are installed. Finally, it is important to ensure that the chip is properly maintained, as it may become damaged if it is not properly maintained.
Overall, the XC73108-12PQ160C chip model is a highly advanced and powerful model with a variety of applications in the networking industry. It has a wide range of features, and is expected to be in high demand in the future due to its versatility and its ability to meet the needs of a wide range of applications. Furthermore, it has a product description and specific design requirements, as well as case studies and precautions that must be taken into consideration when using the chip.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||