XC73108-12PG144C
XC73108-12PG144C
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rohs

AMD Xilinx

XC73108-12PG144C


XC73108-12PG144C
F20-XC73108-12PG144C
Active
UV PLD, 30 ns, 108-Cell, CMOS, WPGA, PGA144,15X15
WPGA, PGA144,15X15

XC73108-12PG144C ECAD Model


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XC73108-12PG144C Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Propagation Delay 30 ns
Number of Dedicated Inputs 12
Number of Macro Cells 108
Number of I/O Lines 78
Programmable Logic Type UV PLD
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 12 DEDICATED INPUTS, 78 I/O
Additional Feature 108 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 3 EXTERNAL CLOCKS; 198 FLIP-FLOPS... more
Clock Frequency-Max 55.6 MHz
In-System Programmable NO
JTAG BST NO
Output Function MACROCELL
Power Supplies 3.3/5,5 V
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
JESD-30 Code S-CPGA-P144
Qualification Status Not Qualified
Moisture Sensitivity Level 1
Operating Temperature-Max 70 °C
Number of Terminals 144
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code WPGA
Package Equivalence Code PGA144,15X15
Package Shape SQUARE
Package Style GRID ARRAY, WINDOW
Surface Mount NO
Terminal Form PIN/PEG
Terminal Pitch 2.54 mm
Terminal Position PERPENDICULAR
Width 39.624 mm
Length 39.624 mm
Seated Height-Max 3.683 mm
Ihs Manufacturer XILINX INC
Part Package Code PGA
Package Description WPGA, PGA144,15X15
Pin Count 144
Reach Compliance Code unknown
HTS Code 8542.39.00.01

XC73108-12PG144C Datasheet Download


XC73108-12PG144C Overview



The XC73108-12PG144C chip model is a high-performance digital signal processing, embedded processing and image processing solution. It is designed to meet the requirements of modern technology applications with its advanced HDL language capabilities. It is suitable for a wide range of applications, from consumer electronics to industrial automation.


The chip model XC73108-12PG144C is designed to provide a powerful and reliable platform for digital signal processing, embedded processing, and image processing. It utilizes HDL language to process data and provide results in a timely manner. The chip model is designed to be highly scalable and can be used in a variety of applications.


The industry trends of the chip model XC73108-12PG144C have been evolving over time. As technology advances, the need for more powerful and reliable solutions is increasing. This chip model is designed to meet the needs of the current market and provide a reliable solution for digital signal processing, embedded processing, and image processing.


The original design intention of the chip model XC73108-12PG144C was to provide a powerful and reliable solution for digital signal processing, embedded processing, and image processing. The chip model is designed to be highly scalable and can be used in a variety of applications. It is also designed to be upgradable to meet the needs of future applications.


The XC73108-12PG144C chip model can be used in advanced communication systems and can be upgraded to meet the needs of future applications. It is designed to be highly scalable and can be used in a variety of applications. It is also designed to be upgradable to meet the needs of future applications.


The chip model XC73108-12PG144C is designed to meet the needs of modern technology applications and provide a powerful and reliable platform for digital signal processing, embedded processing, and image processing. It utilizes HDL language to process data and provide results in a timely manner. The chip model is designed to be highly scalable and can be used in a variety of applications. It is also designed to be upgradable to meet the needs of future applications. The industry trends of the chip model XC73108-12PG144C have been evolving over time and it is capable of supporting new technologies as they become available.



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