AMD Xilinx
XC73108-12PC84C
XC73108-12PC84C ECAD Model
XC73108-12PC84C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Propagation Delay | 30 ns | |
| Number of Dedicated Inputs | 12 | |
| Number of Macro Cells | 108 | |
| Number of I/O Lines | 37 | |
| Programmable Logic Type | OT PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 12 DEDICATED INPUTS, 37 I/O | |
| Additional Feature | 108 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 3 EXTERNAL CLOCKS; 198 FLIP-FLOPS... more | |
| Clock Frequency-Max | 55.6 MHz | |
| In-System Programmable | NO | |
| JTAG BST | NO | |
| Output Function | MACROCELL | |
| Power Supplies | 3.3/5,5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQCC-J84 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 84 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Equivalence Code | LDCC84,1.2SQ | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Width | 29.3116 mm | |
| Length | 29.3116 mm | |
| Seated Height-Max | 5.08 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | LCC | |
| Package Description | PLASTIC, LCC-84 | |
| Pin Count | 84 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC73108-12PC84C Datasheet Download
XC73108-12PC84C Overview
The chip model XC73108-12PC84C is a highly advanced, modern chip model and has been widely used in various industries. It is a major breakthrough in the industry of communication systems and has been widely praised by experts. This chip model has a wide range of applications and is suitable for a variety of communication systems.
In terms of industry trends, the chip model XC73108-12PC84C has been widely used in various industries and has become the standard for many communication systems. With the development of technology, the chip model will be upgraded in the future, and more advanced functions will be added to meet the needs of the industry. In addition, the chip model will also be applied to the development and popularization of future intelligent robots, thus providing more convenience for people's lives.
Regarding the original design intention of the chip model XC73108-12PC84C and its future upgrades, the chip model is designed to provide a reliable and efficient communication system. It has a wide range of applications and can be used in various industries. In the future, the chip model will be upgraded to meet the needs of the industry and the development of technology.
In terms of whether the application environment requires the support of new technologies, it depends on what specific technologies are needed. The chip model XC73108-12PC84C is designed to provide a reliable and efficient communication system, and it can support a variety of technologies. For example, it can support high-speed data transmission, wireless communication, and various advanced communication technologies.
In terms of what technical talents are needed to use the chip model XC73108-12PC84C effectively, it is necessary to have a certain understanding of the chip model and its related technologies. Generally speaking, the technical talents should have a strong understanding of communication systems, wireless communication, and various advanced communication technologies. They should also have experience in the development and application of chip models. In addition, they should have the ability to troubleshoot and maintain the chip model and its related systems.
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|---|---|---|
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