XC73108-12BG225I
XC73108-12BG225I
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rohs

AMD Xilinx

XC73108-12BG225I


XC73108-12BG225I
F20-XC73108-12BG225I
Active
OT PLD, 30 ns, 108-Cell, CMOS, PLASTIC, BGA-225
PLASTIC, BGA-225

XC73108-12BG225I ECAD Model


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XC73108-12BG225I Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Propagation Delay 30 ns
Number of Dedicated Inputs 12
Number of Macro Cells 108
Number of I/O Lines 78
Programmable Logic Type OT PLD
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Organization 12 DEDICATED INPUTS, 78 I/O
Additional Feature 108 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 3 EXTERNAL CLOCKS; 198 FLIP-FLOPS... more
Clock Frequency-Max 55.6 MHz
In-System Programmable NO
JTAG BST NO
Output Function MACROCELL
Power Supplies 3.3/5,5 V
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
JESD-30 Code S-PBGA-B225
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 225
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA225,15X15
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1.5 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description PLASTIC, BGA-225
Pin Count 225
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XC73108-12BG225I Datasheet Download


XC73108-12BG225I Overview


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