AMD Xilinx
XC6VSX475T-3FFG1156C
XC6VSX475T-3FFG1156C ECAD Model
XC6VSX475T-3FFG1156C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of CLBs | 37200 | |
| Combinatorial Delay of a CLB-Max | 590 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 37200 CLBS | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1156 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.53 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Package Description | 35 X 35 MM, LEAD FREE, FBGA-1156 |
XC6VSX475T-3FFG1156C Datasheet Download
XC6VSX475T-3FFG1156C Overview
The XC6VSX475T-3FFG1156C chip model is a powerful and versatile device that is designed to provide a wide range of applications. It is a Field Programmable Gate Array (FPGA) device from Xilinx, one of the leading manufacturers of FPGA products. This model is suitable for a wide range of applications, including digital signal processing, embedded systems, industrial automation, and robotics.
The XC6VSX475T-3FFG1156C chip model offers a number of advantages over other FPGA models. It is a high-performance device that is capable of processing large amounts of data quickly and accurately. It also features a low power consumption and a high level of reliability, making it suitable for use in a wide range of industrial applications. In addition, the device is highly configurable, allowing users to customize it to meet their specific requirements.
The XC6VSX475T-3FFG1156C chip model is expected to be in high demand in the coming years. This is due to the increasing demand for advanced technologies in various industries. For example, the demand for industrial automation and robotics is expected to increase significantly in the near future. As such, the XC6VSX475T-3FFG1156C chip model is expected to be a popular choice for these applications.
The XC6VSX475T-3FFG1156C chip model is designed to meet a wide range of requirements. It is equipped with a wide range of features and capabilities, including high-speed operation, low power consumption, and a high level of reliability. In addition, the device is highly configurable, allowing users to customize it to meet their specific requirements.
The XC6VSX475T-3FFG1156C chip model can be used in the development and popularization of future intelligent robots. It is well-suited for use in robotics due to its high-speed operation, low power consumption, and high level of reliability. In addition, the device is highly configurable, allowing users to customize it to meet their specific requirements.
In order to use the XC6VSX475T-3FFG1156C chip model effectively, users will need to be proficient in a variety of technical skills. These skills include programming, circuit design, and debugging. In addition, users should have a good understanding of the device’s features and capabilities, as well as the specific requirements of their application. With the right technical skills and knowledge, users can make the most of the XC6VSX475T-3FFG1156C chip model and use it to develop and popularize future intelligent robots.
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