AMD Xilinx
XC6VSX315T-L1FFG1156C
XC6VSX315T-L1FFG1156C ECAD Model
XC6VSX315T-L1FFG1156C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 600 | |
| Number of Outputs | 600 | |
| Number of Logic Cells | 314880 | |
| Combinatorial Delay of a CLB-Max | 5.87 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1156 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1156,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 35 X 35 MM, LEAD FREE, FBGA-1156 | |
| Pin Count | 1156 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC6VSX315T-L1FFG1156C Datasheet Download
XC6VSX315T-L1FFG1156C Overview
The XC6VSX315T-L1FFG1156C chip model is a high-performance, low-power FPGA from the Xilinx Virtex-6 family. It is designed for use in high-performance digital signal processing, embedded processing, and image processing applications, and requires the use of HDL language.
The XC6VSX315T-L1FFG1156C chip model offers numerous advantages over other FPGA models. It has a high-performance architecture with up to 8.6 TFLOPS of performance and up to 1536 DSP slices. It also has a low power consumption of only 7.5W, making it an ideal choice for applications requiring high performance and low power consumption. Additionally, it can be used in a variety of applications, ranging from industrial automation to medical imaging.
The demand for the XC6VSX315T-L1FFG1156C chip model is expected to grow in the near future, as more applications require the use of high-performance digital signal processing and embedded processing. In addition, the chip model is expected to be used in a variety of network applications, such as 5G networks and Internet of Things (IoT) applications. It can also be used in intelligent systems, such as autonomous vehicles and robotics.
The XC6VSX315T-L1FFG1156C chip model is a powerful and versatile FPGA that can be used in a variety of applications. Its high performance and low power consumption make it an ideal choice for applications requiring high performance and low power consumption. The demand for the chip model is expected to grow in the near future, as more applications require the use of high-performance digital signal processing and embedded processing. Additionally, it can be used in a variety of network applications and intelligent systems, such as autonomous vehicles and robotics. As the world continues to move towards a fully intelligent future, the XC6VSX315T-L1FFG1156C chip model will be an integral part of the journey.
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4,291 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,523.9010 | $2,523.9010 |
| 10+ | $2,496.7622 | $24,967.6224 |
| 100+ | $2,361.0686 | $236,106.8640 |
| 1000+ | $2,225.3750 | $1,112,687.5200 |
| 10000+ | $2,035.4040 | $2,035,404.0000 |
| The price is for reference only, please refer to the actual quotation! | ||