XC6VSX315T-3FF1759C
XC6VSX315T-3FF1759C
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rohs

AMD Xilinx

XC6VSX315T-3FF1759C


XC6VSX315T-3FF1759C
F20-XC6VSX315T-3FF1759C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-1759
FBGA-1759

XC6VSX315T-3FF1759C ECAD Model


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XC6VSX315T-3FF1759C Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1 V
Number of Inputs 720
Number of Outputs 720
Number of Logic Cells 314880
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 1.412 GHz
Power Supplies 1,1.2/2.5 V
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B1759
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1759
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1759,42X42,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 42.5 mm
Length 42.5 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description FBGA-1759
Pin Count 1759
Reach Compliance Code not_compliant
ECCN Code 3A001.A.7.A
HTS Code 8542.39.00.01

XC6VSX315T-3FF1759C Datasheet Download


XC6VSX315T-3FF1759C Overview



The XC6VSX315T-3FF1759C chip model is a high-performance, versatile device that can be used for a wide range of applications, such as digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, which makes it easier to program and debug.


The original design intention of the XC6VSX315T-3FF1759C chip model was to provide a high-performance solution for digital signal processing, embedded processing, and image processing applications. It has the potential to be upgraded in the future to support more advanced communication systems.


The XC6VSX315T-3FF1759C chip model has a number of features that make it a great choice for these applications. It has a wide range of I/O options, including support for a variety of digital and analog signals, as well as multiple clock sources. It also supports a variety of data formats, including 8-bit, 16-bit, and 32-bit. Additionally, it has an integrated memory controller and a high-speed bus interface.


When designing a system using the XC6VSX315T-3FF1759C chip model, it is important to consider the specific design requirements of the application. This includes the type of data that will be processed, the speed of the processor, the memory requirements, and the power requirements. Additionally, it is important to consider the cost of the device, as well as the time and effort required to program and debug it.


In addition to the design considerations, there are a few things to keep in mind when using the XC6VSX315T-3FF1759C chip model. First, it is important to ensure that the device is properly cooled, as it can overheat if not properly managed. Additionally, it is important to ensure that the device is used in a clean environment, as dust and other particles can cause the device to malfunction. Finally, it is important to ensure that the device is properly programmed, as incorrect programming can lead to unexpected results.


Overall, the XC6VSX315T-3FF1759C chip model is a great choice for applications requiring high-performance digital signal processing, embedded processing, and image processing. It is easy to program and debug, and can be upgraded in the future to support more advanced communication systems. With proper design considerations and precautions, the XC6VSX315T-3FF1759C chip model can be used to great effect in a wide range of applications.



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Unit Price: $5,462.184
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Pricing (USD)

QTY Unit Price Ext Price
1+ $5,079.8311 $5,079.8311
10+ $5,025.2093 $50,252.0928
100+ $4,752.1001 $475,210.0080
1000+ $4,478.9909 $2,239,495.4400
10000+ $4,096.6380 $4,096,638.0000
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