AMD Xilinx
XC6VSX315T-3FF1156C
XC6VSX315T-3FF1156C ECAD Model
XC6VSX315T-3FF1156C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 600 | |
| Number of Outputs | 600 | |
| Number of Logic Cells | 314880 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.412 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1156 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1156,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-1156 | |
| Pin Count | 1156 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC6VSX315T-3FF1156C Datasheet Download
XC6VSX315T-3FF1156C Overview
The chip model XC6VSX315T-3FF1156C is a comprehensive and powerful integrated circuit (IC) chip, developed by Xilinx, Inc., a leading provider of programmable logic solutions. It is a high-performance, low-cost, low-power FPGA (Field Programmable Gate Array) device, specifically designed for high-end applications in the networking, communications, and multimedia markets.
The XC6VSX315T-3FF1156C chip model is an ideal solution for applications requiring high-performance, low-power, and low-cost solutions. Its features include high-speed transceivers, high-performance embedded processors, and advanced memory architectures, enabling it to be used in a variety of networking, communications, and multimedia applications.
In terms of industry trends, the XC6VSX315T-3FF1156C chip model is expected to become increasingly popular in the future, as it is capable of supporting a wide range of applications. It is expected to be used in a variety of intelligent scenarios, such as autonomous driving, robotics, and artificial intelligence. Furthermore, the chip model is expected to be used in the development and popularization of future intelligent robots, as it is capable of providing the necessary resources for the development of such robots.
In terms of the application environment, the XC6VSX315T-3FF1156C chip model is capable of supporting a wide range of new technologies, including advanced memory architectures, high-speed transceivers, and high-performance embedded processors. To use the chip model effectively, technical talents such as software engineers, hardware engineers, and system designers are necessary.
In conclusion, the XC6VSX315T-3FF1156C chip model is a powerful and comprehensive integrated circuit chip, developed by Xilinx, Inc. It is expected to become increasingly popular in the future, as it is capable of supporting a wide range of applications, including autonomous driving, robotics, and artificial intelligence. Furthermore, it is capable of supporting a wide range of new technologies, and technical talents such as software engineers, hardware engineers, and system designers are necessary to use the chip model effectively.
You May Also Be Interested In
2,413 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||