XC6VSX315T-1FF1156C
XC6VSX315T-1FF1156C
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rohs

AMD Xilinx

XC6VSX315T-1FF1156C


XC6VSX315T-1FF1156C
F20-XC6VSX315T-1FF1156C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-1156
FBGA-1156

XC6VSX315T-1FF1156C ECAD Model


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XC6VSX315T-1FF1156C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1 V
Number of Inputs 600
Number of Outputs 600
Number of Logic Cells 314880
Combinatorial Delay of a CLB-Max 5.08 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 1.098 GHz
Power Supplies 1,1.2/2.5 V
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B1156
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1156
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1156,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer XILINX INC
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01
Part Package Code BGA
Package Description FBGA-1156
Pin Count 1156

XC6VSX315T-1FF1156C Datasheet Download


XC6VSX315T-1FF1156C Overview



The XC6VSX315T-1FF1156C is a highly advanced chip model designed for high-performance digital signal processing, embedded processing, and image processing. It is built with the latest Field Programmable Gate Array (FPGA) technology, which enables it to be programmed with the Hardware Description Language (HDL) to meet the specific needs of its users. The chip model is able to provide high-speed performance, low power consumption, and a large number of I/O pins, making it an ideal choice for many applications.


The XC6VSX315T-1FF1156C offers a number of advantages over other chip models. It has a large number of I/O pins, allowing for more flexibility in design. It also has a high-speed performance, allowing it to handle complex tasks quickly and efficiently. Furthermore, it has low power consumption, making it an attractive option for applications that require long battery life.


The XC6VSX315T-1FF1156C is expected to be in high demand in the future, as its capabilities will be increasingly sought after in industries such as automotive, aerospace, and medical. With its ability to handle complex tasks quickly and efficiently, it can be used in a variety of applications, including advanced communication systems. The chip model is also designed to be future-proof, as it can be upgraded and expanded as needed.


The XC6VSX315T-1FF1156C was designed with the intention of providing a high-performance, low-power, and highly flexible chip model. The chip model is able to provide a high-speed performance, low power consumption, and a large number of I/O pins, making it an ideal choice for many applications. Additionally, its design allows it to be upgraded and expanded as needed, making it a great choice for applications that require future-proofing. Finally, its ability to be programmed with HDL makes it a great choice for applications that require complex tasks to be performed quickly and efficiently.



3,051 In Stock


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Unit Price: $2,713.872
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Pricing (USD)

QTY Unit Price Ext Price
1+ $2,523.9010 $2,523.9010
10+ $2,496.7622 $24,967.6224
100+ $2,361.0686 $236,106.8640
1000+ $2,225.3750 $1,112,687.5200
10000+ $2,035.4040 $2,035,404.0000
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