
AMD Xilinx
XC6VSX315T-1FF1156C
XC6VSX315T-1FF1156C ECAD Model
XC6VSX315T-1FF1156C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 600 | |
Number of Outputs | 600 | |
Number of Logic Cells | 314880 | |
Combinatorial Delay of a CLB-Max | 5.08 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Clock Frequency-Max | 1.098 GHz | |
Power Supplies | 1,1.2/2.5 V | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B1156 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1156 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1156,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 | |
Part Package Code | BGA | |
Package Description | FBGA-1156 | |
Pin Count | 1156 |
XC6VSX315T-1FF1156C Datasheet Download
XC6VSX315T-1FF1156C Overview
The XC6VSX315T-1FF1156C is a highly advanced chip model designed for high-performance digital signal processing, embedded processing, and image processing. It is built with the latest Field Programmable Gate Array (FPGA) technology, which enables it to be programmed with the Hardware Description Language (HDL) to meet the specific needs of its users. The chip model is able to provide high-speed performance, low power consumption, and a large number of I/O pins, making it an ideal choice for many applications.
The XC6VSX315T-1FF1156C offers a number of advantages over other chip models. It has a large number of I/O pins, allowing for more flexibility in design. It also has a high-speed performance, allowing it to handle complex tasks quickly and efficiently. Furthermore, it has low power consumption, making it an attractive option for applications that require long battery life.
The XC6VSX315T-1FF1156C is expected to be in high demand in the future, as its capabilities will be increasingly sought after in industries such as automotive, aerospace, and medical. With its ability to handle complex tasks quickly and efficiently, it can be used in a variety of applications, including advanced communication systems. The chip model is also designed to be future-proof, as it can be upgraded and expanded as needed.
The XC6VSX315T-1FF1156C was designed with the intention of providing a high-performance, low-power, and highly flexible chip model. The chip model is able to provide a high-speed performance, low power consumption, and a large number of I/O pins, making it an ideal choice for many applications. Additionally, its design allows it to be upgraded and expanded as needed, making it a great choice for applications that require future-proofing. Finally, its ability to be programmed with HDL makes it a great choice for applications that require complex tasks to be performed quickly and efficiently.
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3,051 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $2,523.9010 | $2,523.9010 |
10+ | $2,496.7622 | $24,967.6224 |
100+ | $2,361.0686 | $236,106.8640 |
1000+ | $2,225.3750 | $1,112,687.5200 |
10000+ | $2,035.4040 | $2,035,404.0000 |
The price is for reference only, please refer to the actual quotation! |