AMD Xilinx
XC6VLX760-3FF1760C
XC6VLX760-3FF1760C ECAD Model
XC6VLX760-3FF1760C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC6VLX760-3FF1760C Datasheet Download
XC6VLX760-3FF1760C Overview
The chip model XC6VLX760-3FF1760C is a powerful, high-performance chip developed by Xilinx, a leading provider of programmable logic devices and advanced embedded systems. It is designed to provide a comprehensive solution for modern communication systems, such as high speed, low latency, and high throughput. This chip model is equipped with a range of features, including a high-bandwidth memory interface, a high-performance processor core, and a multi-channel DMA engine.
The XC6VLX760-3FF1760C chip model is capable of supporting a variety of applications in the fields of networking, computing, and storage. It is also able to provide support for advanced communication systems, such as 5G, Wi-Fi 6, and LTE. The chip model is also capable of providing support for the latest technologies, such as AI, machine learning, deep learning, and edge computing.
The XC6VLX760-3FF1760C chip model is also suitable for use in the era of fully intelligent systems. It can be used in a variety of intelligent scenarios, such as autonomous vehicles, smart homes, and smart factories. The chip model is also capable of providing support for the latest intelligent technologies, such as natural language processing, computer vision, and robotics.
The XC6VLX760-3FF1760C chip model is designed to be upgradeable, allowing for future upgrades and applications. It is also capable of providing support for a wide range of communication protocols, such as Ethernet, Wi-Fi, and Bluetooth. The chip model also supports a range of operating systems, such as Linux, Windows, and Android.
The XC6VLX760-3FF1760C chip model is a powerful and versatile chip model that is suitable for a variety of applications. It is capable of providing support for the latest technologies, such as AI, machine learning, deep learning, and edge computing. It is also capable of providing support for a wide range of communication protocols and operating systems. The chip model is also upgradeable and can be used in a variety of intelligent scenarios. This makes it an ideal choice for modern communication systems and the era of fully intelligent systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||