AMD Xilinx
XC6VLX760-2FF1760E
XC6VLX760-2FF1760E ECAD Model
XC6VLX760-2FF1760E Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 1200 | |
| Number of Outputs | 1200 | |
| Number of Logic Cells | 758784 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.286 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1760 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1760 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1760,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-1760 | |
| Pin Count | 1760 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.A | |
| HTS Code | 8542.39.00.01 |
XC6VLX760-2FF1760E Datasheet Download
XC6VLX760-2FF1760E Overview
The chip model XC6VLX760-2FF1760E is a highly advanced, powerful, and versatile model that is suitable for a variety of applications. It is an ideal choice for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language.
The chip model XC6VLX760-2FF1760E is designed to keep up with the latest industry trends and ensure that it can continue to meet the demands of the future. This means that the model must be able to support new technologies as the industry evolves. It is also important for the model to be easily integrated into existing systems and be able to take advantage of the latest advancements in technology.
The chip model XC6VLX760-2FF1760E can be used in the development and popularization of future intelligent robots. This requires a team of experienced technical professionals who are knowledgeable in both the model and the necessary technologies. They must be able to effectively use the model, understand the implications of the new technologies, and be able to implement them into the robots.
In conclusion, the chip model XC6VLX760-2FF1760E is a powerful and versatile model that is suitable for a variety of applications. It is designed to keep up with the latest industry trends and ensure that it can continue to meet the demands of the future. It can also be used in the development and popularization of future intelligent robots, but this requires the use of experienced technical professionals who are knowledgeable in both the model and the necessary technologies.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||