XC6VLX760-1FF1760C

The XC6VLX760-1FF1760C is a Field Programmable Gate Array (FPGA) chip manufactured by Xilinx. It is based on the Virtex-6 family of FPGAs, and is designed for high-performance applications. It has a total of 760,000 logic cells, 1.76 million flip-flops, and a total of 1760 I/O pins. The chip has an operating temperature range of 0°C to 85°C, and a maximum power dissipation of 18.5 watts.

The chip has a number of features which make it suitable for a wide range of applications. It has built-in support for DDR3, PCIe Gen2, and 10G Ethernet, as well as a wide range of I/O standards such as LVDS, LVCMOS, and SSTL. It also includes a number of high-speed transceivers, which support data rates up to 10.3125 Gbps.

The chip is designed for use in a variety of applications, including communications, networking, industrial automation, medical imaging, and aerospace. Its high-speed transceivers and wide range of I/O standards make it suitable for use in high-speed data processing applications. Its low power consumption and wide operating temperature range also make it suitable for use in embedded applications. In addition, its support for DDR3 and PCIe Gen2 make it suitable for use in high-performance computing applications.