XC6VLX75T-3FFG784I
XC6VLX75T-3FFG784I
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AMD Xilinx

XC6VLX75T-3FFG784I


XC6VLX75T-3FFG784I
F20-XC6VLX75T-3FFG784I
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XC6VLX75T-3FFG784I ECAD Model


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XC6VLX75T-3FFG784I Attributes


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XC6VLX75T-3FFG784I Overview



The XC6VLX75T-3FFG784I is a high-performance FPGA chip model developed by Xilinx, Inc., a leading provider of programmable logic devices. This model is designed to provide a high-speed, low-power solution for a wide range of applications, including advanced communication systems.


The original design intention of the XC6VLX75T-3FFG784I was to provide a reliable, high-performance solution for a variety of tasks. It is equipped with a high-performance 7 series FPGA architecture, which enables it to process data at speeds of up to 500MHz. Additionally, the chip is designed to be energy-efficient and consumes only a fraction of the power required by other similar FPGAs.


The XC6VLX75T-3FFG784I is also designed with the possibility of future upgrades in mind. It is equipped with a wide range of features, including advanced I/O support, high-speed transceivers, and a wide variety of configuration options. These features allow the chip to be used in a variety of applications, including advanced communication systems. Additionally, the chip can be easily upgraded with the latest features and technologies, ensuring that it remains up-to-date with the latest advancements.


The XC6VLX75T-3FFG784I is also designed to be used in the era of fully intelligent systems. It is equipped with a wide range of features that make it suitable for use in a variety of intelligent scenarios, such as autonomous driving, robotics, and machine learning. Additionally, the chip is capable of supporting a wide range of protocols, including Ethernet and USB, making it suitable for use in a variety of networked applications.


In addition to its design features, the XC6VLX75T-3FFG784I also has a number of product specifications and requirements. These include a wide range of I/O requirements, a maximum operating temperature of 0°C to 85°C, and a maximum power consumption of 4.25W. Additionally, the chip is also designed to be compatible with a wide range of development tools, such as the Xilinx Vivado Design Suite.


Finally, the XC6VLX75T-3FFG784I is designed to be used in a wide range of real-world applications. A number of case studies have been conducted to demonstrate the chip's capabilities, including a study on the implementation of an Ethernet-based home automation system. Additionally, a number of precautions should be taken when using the chip, including ensuring that it is properly cooled and that it is not exposed to any extreme temperatures.


In conclusion, the XC6VLX75T-3FFG784I is a high-performance FPGA chip model designed for a wide range of applications. It is equipped with a wide range of features and is capable of supporting a variety of protocols, making it suitable for use in advanced communication systems. Additionally, the chip is designed to be easily upgradable and is suitable for use in the era of fully intelligent systems. Finally, it has a number of product specifications and requirements, as well as a number of case studies demonstrating its capabilities.



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