
AMD Xilinx
XC6VLX75T-3FF784C
XC6VLX75T-3FF784C ECAD Model
XC6VLX75T-3FF784C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 360 | |
Number of Outputs | 360 | |
Number of Logic Cells | 74496 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Clock Frequency-Max | 1.412 GHz | |
Power Supplies | 1,1.2/2.5 V | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B784 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 220 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 784 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA784,28X28,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 29 mm | |
Length | 29 mm | |
Seated Height-Max | 2.86 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | FBGA-784 | |
Pin Count | 784 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC6VLX75T-3FF784C Datasheet Download
XC6VLX75T-3FF784C Overview
The XC6VLX75T-3FF784C chip model is a high-performance, low-power FPGA from Xilinx. It is based on the Virtex-6 family of FPGAs, which are designed for applications that require high-performance and low-power consumption. The chip model is ideal for use in a variety of applications, including high-speed networking, embedded vision, and high-end computing.
The XC6VLX75T-3FF784C chip model has a number of advantages that make it well-suited for use in many industries. It has a high clock frequency of up to 750MHz, making it suitable for high-speed applications. It also has a low power consumption of up to 5W, making it an ideal choice for low-power applications. In addition, it has a high logic density of up to 3.3 million logic cells, allowing it to be used in a variety of applications.
The XC6VLX75T-3FF784C chip model is expected to see increased demand in the future, as its advantages make it an ideal choice for many applications. It is well-suited for use in high-speed networking, embedded vision, and high-end computing. It is also well-suited for use in the development and popularization of future intelligent robots.
The original design intention of the XC6VLX75T-3FF784C chip model was to provide high-performance and low-power consumption. It has been designed to meet the needs of a variety of applications, and is expected to be upgraded in the future to meet the needs of more advanced applications. It is expected to be able to support more advanced communication systems in the future, as well as the development and popularization of future intelligent robots.
In order to use the XC6VLX75T-3FF784C chip model effectively, a number of technical talents are needed. These include knowledge of digital design and logic synthesis, as well as knowledge of embedded systems. In addition, knowledge of FPGA architecture and programming is also required. Knowledge of system-on-chip (SoC) design, computer-aided design (CAD) tools, and embedded software development is also important. With the right technical talents, the XC6VLX75T-3FF784C chip model can be used effectively to meet the needs of a variety of applications.
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5,872 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $1,033.9368 | $1,033.9368 |
10+ | $1,022.8192 | $10,228.1920 |
100+ | $967.2312 | $96,723.1200 |
1000+ | $911.6432 | $455,821.6000 |
10000+ | $833.8200 | $833,820.0000 |
The price is for reference only, please refer to the actual quotation! |