XC6VLX75T-3FF784C
XC6VLX75T-3FF784C
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rohs

AMD Xilinx

XC6VLX75T-3FF784C


XC6VLX75T-3FF784C
F20-XC6VLX75T-3FF784C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-784
FBGA-784

XC6VLX75T-3FF784C ECAD Model


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XC6VLX75T-3FF784C Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1 V
Number of Inputs 360
Number of Outputs 360
Number of Logic Cells 74496
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 1.412 GHz
Power Supplies 1,1.2/2.5 V
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B784
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 220
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 784
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA784,28X28,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 29 mm
Length 29 mm
Seated Height-Max 2.86 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description FBGA-784
Pin Count 784
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC6VLX75T-3FF784C Datasheet Download


XC6VLX75T-3FF784C Overview



The XC6VLX75T-3FF784C chip model is a high-performance, low-power FPGA from Xilinx. It is based on the Virtex-6 family of FPGAs, which are designed for applications that require high-performance and low-power consumption. The chip model is ideal for use in a variety of applications, including high-speed networking, embedded vision, and high-end computing.


The XC6VLX75T-3FF784C chip model has a number of advantages that make it well-suited for use in many industries. It has a high clock frequency of up to 750MHz, making it suitable for high-speed applications. It also has a low power consumption of up to 5W, making it an ideal choice for low-power applications. In addition, it has a high logic density of up to 3.3 million logic cells, allowing it to be used in a variety of applications.


The XC6VLX75T-3FF784C chip model is expected to see increased demand in the future, as its advantages make it an ideal choice for many applications. It is well-suited for use in high-speed networking, embedded vision, and high-end computing. It is also well-suited for use in the development and popularization of future intelligent robots.


The original design intention of the XC6VLX75T-3FF784C chip model was to provide high-performance and low-power consumption. It has been designed to meet the needs of a variety of applications, and is expected to be upgraded in the future to meet the needs of more advanced applications. It is expected to be able to support more advanced communication systems in the future, as well as the development and popularization of future intelligent robots.


In order to use the XC6VLX75T-3FF784C chip model effectively, a number of technical talents are needed. These include knowledge of digital design and logic synthesis, as well as knowledge of embedded systems. In addition, knowledge of FPGA architecture and programming is also required. Knowledge of system-on-chip (SoC) design, computer-aided design (CAD) tools, and embedded software development is also important. With the right technical talents, the XC6VLX75T-3FF784C chip model can be used effectively to meet the needs of a variety of applications.



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Unit Price: $1,111.76
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Pricing (USD)

QTY Unit Price Ext Price
1+ $1,033.9368 $1,033.9368
10+ $1,022.8192 $10,228.1920
100+ $967.2312 $96,723.1200
1000+ $911.6432 $455,821.6000
10000+ $833.8200 $833,820.0000
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