XC6VLX75T-2FF784I
XC6VLX75T-2FF784I
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XC6VLX75T-2FF784I


XC6VLX75T-2FF784I
F20-XC6VLX75T-2FF784I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-784
FBGA-784

XC6VLX75T-2FF784I ECAD Model


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XC6VLX75T-2FF784I Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1 V
Number of Inputs 360
Number of Outputs 360
Number of Logic Cells 74496
Combinatorial Delay of a CLB-Max 4.29 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 1.286 GHz
Power Supplies 1,1.2/2.5 V
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B784
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 220
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 784
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA784,28X28,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 29 mm
Length 29 mm
Seated Height-Max 2.86 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description FBGA-784
Pin Count 784
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC6VLX75T-2FF784I Datasheet Download


XC6VLX75T-2FF784I Overview



The XC6VLX75T-2FF784I chip model is one of the latest developments in the field of integrated circuits. It is a high-performance, low-power, and low-cost FPGA that is designed to meet the needs of a variety of applications. The chip model is based on the Virtex-6 family of FPGAs, which is the latest generation of FPGA technology from Xilinx. It offers a wide range of features and capabilities, including high-speed transceivers, high-speed memory, advanced I/O, and high-density logic.


The XC6VLX75T-2FF784I chip model is designed to provide a highly cost-effective solution for a variety of applications. It is optimized for power and performance, and offers a high level of integration, making it suitable for a wide range of applications. It is also designed to be highly reliable, offering a long life cycle and low failure rate.


In terms of industry trends, the XC6VLX75T-2FF784I chip model is expected to see increasing demand in the coming years. This is due to its low-power, low-cost, and high-performance capabilities, which make it ideal for a variety of applications. It is also expected to be a popular choice for communication systems, as it offers advanced features such as high-speed transceivers, high-speed memory, and advanced I/O.


The original design intention of the XC6VLX75T-2FF784I chip model was to provide a low-cost and low-power solution for a variety of applications. It is designed to be highly reliable and offers a long life cycle. In terms of future upgrades, the chip model is designed to be highly configurable and can be upgraded to support new technologies as they become available. This makes it an ideal choice for applications that require support for new technologies.


In conclusion, the XC6VLX75T-2FF784I chip model is a highly cost-effective and reliable solution for a variety of applications. It is expected to see increasing demand in the coming years due to its low-power, low-cost, and high-performance capabilities. Additionally, it is designed to be highly configurable and can be upgraded to support new technologies as they become available. This makes it an ideal choice for applications that require support for new technologies.



1,568 In Stock


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Unit Price: $1,111.76
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Pricing (USD)

QTY Unit Price Ext Price
1+ $1,033.9368 $1,033.9368
10+ $1,022.8192 $10,228.1920
100+ $967.2312 $96,723.1200
1000+ $911.6432 $455,821.6000
10000+ $833.8200 $833,820.0000
The price is for reference only, please refer to the actual quotation!

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