AMD Xilinx
XC6VLX75T-2FF784C
XC6VLX75T-2FF784C ECAD Model
XC6VLX75T-2FF784C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 360 | |
| Number of Outputs | 360 | |
| Number of Logic Cells | 74496 | |
| Combinatorial Delay of a CLB-Max | 4.29 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.286 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B784 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 784 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA784,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 2.86 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-784 | |
| Pin Count | 784 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC6VLX75T-2FF784C Datasheet Download
XC6VLX75T-2FF784C Overview
The XC6VLX75T-2FF784C chip model has been designed with a range of features and capabilities that make it an ideal choice for a variety of applications. The chip model is a field-programmable gate array (FPGA) device, providing a low-power, high-performance solution for a wide range of applications. It is especially suitable for applications that require high-speed data processing, such as communications and networking.
The XC6VLX75T-2FF784C chip model is designed to be highly configurable and can be used in a variety of environments. It is capable of supporting a range of high-speed communication protocols, such as Ethernet, Fibre Channel, and InfiniBand. It also supports a variety of other protocols, such as Serial RapidIO, PCI Express, and Serial ATA. The chip model is also able to support a range of hardware accelerators, such as the Xilinx LogiCORE IP cores.
The XC6VLX75T-2FF784C chip model is designed to be highly scalable and can be used in a variety of applications. It is capable of supporting a range of applications, such as communications, networking, and storage. It is also capable of supporting a range of intelligent scenarios, such as machine learning, image processing, and natural language processing. The chip model is also capable of supporting a range of advanced communication systems, such as 5G and beyond.
The XC6VLX75T-2FF784C chip model is designed to be future-proof and has the potential to be upgraded in the future. It is capable of supporting a range of new technologies, such as 3D integration and optical interconnects. It is also capable of supporting a range of advanced communication systems, such as 5G and beyond. The chip model is also capable of supporting a range of intelligent scenarios, such as machine learning, image processing, and natural language processing.
In conclusion, the XC6VLX75T-2FF784C chip model provides a low-power, high-performance solution for a wide range of applications. It is capable of supporting a range of high-speed communication protocols, such as Ethernet, Fibre Channel, and InfiniBand. It is also capable of supporting a range of hardware accelerators, such as the Xilinx LogiCORE IP cores. The chip model is also capable of supporting a range of advanced communication systems, such as 5G and beyond. It is also capable of supporting a range of new technologies, such as 3D integration and optical interconnects, and it is capable of supporting a range of intelligent scenarios, such as machine learning, image processing, and natural language processing. The XC6VLX75T-2FF784C chip model is an ideal choice for a variety of applications and is designed to be future-proof and highly scalable.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
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