XC6VLX550T-2FFG1760E
XC6VLX550T-2FFG1760E
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rohs

AMD Xilinx

XC6VLX550T-2FFG1760E


XC6VLX550T-2FFG1760E
F20-XC6VLX550T-2FFG1760E
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS
BGA

XC6VLX550T-2FFG1760E ECAD Model


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XC6VLX550T-2FFG1760E Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Number of Inputs 1200
Number of Outputs 1200
Number of Logic Cells 549888
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 1.286 GHz
Power Supplies 1,1.2/2.5 V
JESD-30 Code S-PBGA-B1760
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 4
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1760
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1760,42X42,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Ihs Manufacturer XILINX INC
Reach Compliance Code not_compliant
ECCN Code 3A001.A.7.A
HTS Code 8542.39.00.01

XC6VLX550T-2FFG1760E Datasheet Download


XC6VLX550T-2FFG1760E Overview



The chip model XC6VLX550T-2FFG1760E is a new generation of integrated circuit (IC) developed by Xilinx, a leading provider of advanced programmable logic solutions. The chip model is designed to provide high-performance, low-power solutions for a wide range of applications, such as networking, machine learning, and artificial intelligence. It is a highly integrated, low-power, and high-performance device that can be used for a variety of applications, including networking, machine learning, and artificial intelligence.


The XC6VLX550T-2FFG1760E chip model is designed to meet the needs of a wide range of applications, including network solutions, machine learning, and artificial intelligence. It is equipped with a wide range of features, including a high-performance processor, a powerful memory controller, and a wide range of I/O options. These features make it an ideal choice for applications that require high performance and low power consumption.


The XC6VLX550T-2FFG1760E chip model can be used in a variety of intelligent scenarios, such as autonomous vehicles, smart home systems, and robotics. It can be used to create intelligent systems that can process data quickly and accurately, and can be used to develop and deploy a wide range of applications. The chip model is also suitable for use in the era of fully intelligent systems, as it can be used to create intelligent systems that can process data quickly and accurately.


The XC6VLX550T-2FFG1760E chip model is also suitable for use in the development and popularization of future intelligent robots. It is equipped with a wide range of features, including a high-performance processor, a powerful memory controller, and a wide range of I/O options. These features make it an ideal choice for applications that require high performance and low power consumption.


In order to use the XC6VLX550T-2FFG1760E chip model effectively, it is important to understand the product description and specific design requirements of the chip model. It is also important to understand the actual case studies and precautions associated with using the chip model. Technical talents such as software engineers, hardware engineers, and system architects are needed to use the chip model effectively.


In conclusion, the XC6VLX550T-2FFG1760E chip model is a new generation of integrated circuit (IC) developed by Xilinx, a leading provider of advanced programmable logic solutions. It is designed to provide high-performance, low-power solutions for a wide range of applications, such as networking, machine learning, and artificial intelligence. It can be used in a variety of intelligent scenarios, such as autonomous vehicles, smart home systems, and robotics. It is also suitable for use in the development and popularization of future intelligent robots. In order to use the chip model effectively, it is important to understand the product description and specific design requirements, as well as the actual case studies and precautions associated with using the chip model. Technical talents such as software engineers, hardware engineers, and system architects are needed to use the chip model effectively.



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