AMD Xilinx
XC6VLX550T-2FF1760E
XC6VLX550T-2FF1760E ECAD Model
XC6VLX550T-2FF1760E Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 1200 | |
| Number of Outputs | 1200 | |
| Number of Logic Cells | 549888 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.286 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1760 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1760 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1760,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-1760 | |
| Pin Count | 1760 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.A | |
| HTS Code | 8542.39.00.01 |
XC6VLX550T-2FF1760E Datasheet Download
XC6VLX550T-2FF1760E Overview
The Xilinx XC6VLX550T-2FF1760E is a field programmable gate array (FPGA) chip model that is designed for high-performance applications. It is a high-end FPGA chip that is suitable for a wide range of applications, from communications to embedded systems. This chip model has been designed to provide high-speed data processing and a high degree of flexibility for system designers.
The XC6VLX550T-2FF1760E has a wide range of features that make it suitable for a variety of applications. It has a high-performance Xilinx Virtex-6 FPGA architecture, which allows for fast data processing and a high degree of flexibility. It also has a large number of I/O pins, which allows for easy connection to external devices. Additionally, the chip model has a large number of logic cells, which allows for the implementation of complex algorithms.
The XC6VLX550T-2FF1760E is designed to be upgradeable, which means that it can be used in future applications as technology advances. This makes it a great choice for applications that require a high level of flexibility and scalability. Additionally, the chip model is well suited for advanced communication systems. It has an integrated transceiver, which allows for high-speed data transmission and reception. It also has a large number of I/O pins, which allows for easy connection to external devices.
The XC6VLX550T-2FF1760E is also suitable for the development and popularization of future intelligent robots. It has a high-performance Xilinx Virtex-6 FPGA architecture, which allows for fast data processing and a high degree of flexibility. Additionally, the chip model has a large number of logic cells, which allows for the implementation of complex algorithms. To use the model effectively, technical talents such as engineers and programmers will be needed.
In conclusion, the Xilinx XC6VLX550T-2FF1760E is a high-end FPGA chip model that is designed for high-performance applications. It is a great choice for applications that require a high level of flexibility and scalability, as it is upgradeable and can be used in advanced communication systems. Additionally, the chip model is suitable for the development and popularization of future intelligent robots. To use the model effectively, technical talents such as engineers and programmers will be needed.
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