AMD Xilinx
XC6VLX365T-3FF1156I
XC6VLX365T-3FF1156I ECAD Model
XC6VLX365T-3FF1156I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Number of Inputs | 600 | |
| Number of Outputs | 600 | |
| Number of Logic Cells | 364032 | |
| Number of CLBs | 28440 | |
| Combinatorial Delay of a CLB-Max | 590 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 28440 CLBS | |
| Clock Frequency-Max | 1.412 GHz | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1156 | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1156,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | BGA, BGA1156,34X34,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC6VLX365T-3FF1156I Datasheet Download
XC6VLX365T-3FF1156I Overview
The chip model XC6VLX365T-3FF1156I is a modern FPGA (Field Programmable Gate Array) from Xilinx that is suitable for a range of applications, including high-performance digital signal processing, embedded processing, and image processing. It is designed to be programmed using a hardware description language (HDL) such as Verilog or VHDL. This chip offers a variety of features and advantages that make it an ideal choice for many applications.
The XC6VLX365T-3FF1156I is based on the Xilinx Virtex-6 FPGA architecture, which is known for its high performance and low power consumption. It is also designed to be highly configurable, allowing users to customize their solutions to meet their specific needs. As a result, this chip model is becoming increasingly popular in a variety of industries, such as automotive, aerospace, and medical.
The XC6VLX365T-3FF1156I is designed to be used in high-performance digital signal processing, embedded processing, and image processing applications. It is also capable of supporting advanced communication systems, such as 5G and beyond. This makes it an ideal choice for a wide range of applications. Additionally, the chip model is designed to be easily upgradable, allowing users to add new features and functionality as needed.
The XC6VLX365T-3FF1156I is a powerful and versatile chip model that is suitable for a variety of applications. It is highly configurable, allowing users to customize their solutions to meet their specific needs. Additionally, it is capable of supporting advanced communication systems, making it an ideal choice for a wide range of applications. As the demand for FPGAs continues to grow, this chip model is expected to be in high demand in many industries.
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2,510 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $5,917.5677 | $5,917.5677 |
| 10+ | $5,853.9379 | $58,539.3792 |
| 100+ | $5,535.7891 | $553,578.9120 |
| 1000+ | $5,217.6403 | $2,608,820.1600 |
| 10000+ | $4,772.2320 | $4,772,232.0000 |
| The price is for reference only, please refer to the actual quotation! | ||