XC6VLX365T-3FF1156C
XC6VLX365T-3FF1156C
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rohs

AMD Xilinx

XC6VLX365T-3FF1156C


XC6VLX365T-3FF1156C
F20-XC6VLX365T-3FF1156C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-1156
FBGA-1156

XC6VLX365T-3FF1156C ECAD Model


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XC6VLX365T-3FF1156C Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1 V
Number of Inputs 600
Number of Outputs 600
Number of Logic Cells 364032
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 1.412 GHz
Power Supplies 1,1.2/2.5 V
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B1156
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1156
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1156,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description FBGA-1156
Pin Count 1156
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC6VLX365T-3FF1156C Datasheet Download


XC6VLX365T-3FF1156C Overview



The chip model XC6VLX365T-3FF1156C is an advanced technology that has been developed to meet the demands of the latest networks and intelligent systems. This model is a powerful tool that can be used to create highly efficient, reliable, and secure networks and intelligent systems. It is a versatile and highly customizable model that can be used in a variety of applications.


The XC6VLX365T-3FF1156C chip model is designed to enable the development of next-generation networks and intelligent systems. It provides a comprehensive suite of features and capabilities, including advanced security features, high-performance networking, and integrated intelligent systems. It is designed to be highly efficient and reliable, and is capable of handling large amounts of data.


The XC6VLX365T-3FF1156C chip model can be used in a variety of applications, including the development of networks and intelligent systems. It is capable of being used in the era of fully intelligent systems, as it can be used to create highly efficient, reliable, and secure networks and intelligent systems. It is also capable of being used in the development and popularization of future intelligent robots.


In order to effectively use the XC6VLX365T-3FF1156C chip model, it is important to understand the product description and specific design requirements. It is also important to understand the actual case studies and precautions that should be taken when using the chip model. Technical talents such as software engineers, hardware engineers, and system administrators are needed to use the model effectively.


In conclusion, the XC6VLX365T-3FF1156C chip model is a powerful tool that can be used to create highly efficient, reliable, and secure networks and intelligent systems. It can be used in a variety of applications, including the development of networks and intelligent systems, and can be used in the era of fully intelligent systems. It can also be used in the development and popularization of future intelligent robots. In order to effectively use the model, it is important to understand the product description and specific design requirements, as well as the actual case studies and precautions that should be taken. Technical talents such as software engineers, hardware engineers, and system administrators are also needed to use the model effectively.



1,066 In Stock


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Unit Price: $5,096.136
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Pricing (USD)

QTY Unit Price Ext Price
1+ $4,739.4065 $4,739.4065
10+ $4,688.4451 $46,884.4512
100+ $4,433.6383 $443,363.8320
1000+ $4,178.8315 $2,089,415.7600
10000+ $3,822.1020 $3,822,102.0000
The price is for reference only, please refer to the actual quotation!

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