XC6VLX365T-2FF1759I
XC6VLX365T-2FF1759I
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rohs

AMD Xilinx

XC6VLX365T-2FF1759I


XC6VLX365T-2FF1759I
F20-XC6VLX365T-2FF1759I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-1759
FBGA-1759

XC6VLX365T-2FF1759I ECAD Model


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XC6VLX365T-2FF1759I Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1 V
Number of Inputs 720
Number of Outputs 720
Number of Logic Cells 364032
Combinatorial Delay of a CLB-Max 4.29 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 1.286 GHz
Power Supplies 1,1.2/2.5 V
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B1759
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1759
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1759,42X42,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 42.5 mm
Length 42.5 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description FBGA-1759
Pin Count 1759
Reach Compliance Code not_compliant
ECCN Code 3A001.A.7.A
HTS Code 8542.39.00.01

XC6VLX365T-2FF1759I Datasheet Download


XC6VLX365T-2FF1759I Overview



The chip model XC6VLX365T-2FF1759I is a powerful model developed by Xilinx, Inc., a leading provider of programmable logic devices. It is based on their Virtex-6 FPGA family, which is designed to meet the needs of high-performance applications. The model is designed to deliver high-speed, low-power, and cost-effective solutions for applications that require high-performance, low-power, and cost-effective solutions.


In terms of industry trends, the XC6VLX365T-2FF1759I chip model is a great choice for applications requiring high-speed, low-power, and cost-effective solutions. It is designed to meet the needs of a wide range of applications, from networking and embedded systems to high-performance computing. It is also designed to be compatible with a variety of technologies, including Ethernet, Serial RapidIO, and PCI Express.


When it comes to future applications, the XC6VLX365T-2FF1759I chip model is well suited for use in intelligent systems. It is capable of supporting a variety of technologies, including artificial intelligence, machine learning, and deep learning. It is also capable of supporting advanced networking technologies such as 5G, Wi-Fi 6, and Bluetooth 5.0. This makes it a great choice for applications such as autonomous vehicles, smart home systems, and IoT networks.


In terms of product description, the XC6VLX365T-2FF1759I chip model is designed to deliver high-speed, low-power, and cost-effective solutions. It is designed to be compatible with a variety of technologies, including Ethernet, Serial RapidIO, and PCI Express. It is also designed to be compatible with a wide range of operating systems, including Linux, Windows, and Android. It is also designed to be compatible with a variety of development tools, including Vivado Design Suite, Xilinx SDK, and Xilinx Platform Studio.


When it comes to actual case studies, the XC6VLX365T-2FF1759I chip model has been used in a variety of applications, including autonomous vehicles, smart home systems, and IoT networks. It has also been used in a variety of industrial applications, including machine vision systems, industrial automation systems, and robotics.


When it comes to precautions, it is important to note that the XC6VLX365T-2FF1759I chip model is designed to be compatible with a variety of technologies, but it is not designed to support all technologies. It is important to ensure that the chip model is compatible with the specific technologies required for the application. Additionally, it is important to ensure that the chip model is configured correctly to meet the specific requirements of the application.


Overall, the XC6VLX365T-2FF1759I chip model is a powerful model developed by Xilinx, Inc. It is designed to deliver high-speed, low-power, and cost-effective solutions for applications that require high-performance, low-power, and cost-effective solutions. It is also designed to be compatible with a variety of technologies, including Ethernet, Serial RapidIO, and PCI Express. It is well suited for use in intelligent systems, and it has been used in a variety of applications, including autonomous vehicles, smart home systems, and IoT networks. When it comes to precautions, it is important to ensure that the chip model is compatible with the specific technologies required for the application and that it is configured correctly to meet the specific requirements of the application.



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Unit Price: $5,859.72
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QTY Unit Price Ext Price
1+ $5,449.5396 $5,449.5396
10+ $5,390.9424 $53,909.4240
100+ $5,097.9564 $509,795.6400
1000+ $4,804.9704 $2,402,485.2000
10000+ $4,394.7900 $4,394,790.0000
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