
AMD Xilinx
XC6VLX365T-2FF1759I
XC6VLX365T-2FF1759I ECAD Model
XC6VLX365T-2FF1759I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 720 | |
Number of Outputs | 720 | |
Number of Logic Cells | 364032 | |
Combinatorial Delay of a CLB-Max | 4.29 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Clock Frequency-Max | 1.286 GHz | |
Power Supplies | 1,1.2/2.5 V | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B1759 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1759 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1759,42X42,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 42.5 mm | |
Length | 42.5 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | FBGA-1759 | |
Pin Count | 1759 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A001.A.7.A | |
HTS Code | 8542.39.00.01 |
XC6VLX365T-2FF1759I Datasheet Download
XC6VLX365T-2FF1759I Overview
The chip model XC6VLX365T-2FF1759I is a powerful model developed by Xilinx, Inc., a leading provider of programmable logic devices. It is based on their Virtex-6 FPGA family, which is designed to meet the needs of high-performance applications. The model is designed to deliver high-speed, low-power, and cost-effective solutions for applications that require high-performance, low-power, and cost-effective solutions.
In terms of industry trends, the XC6VLX365T-2FF1759I chip model is a great choice for applications requiring high-speed, low-power, and cost-effective solutions. It is designed to meet the needs of a wide range of applications, from networking and embedded systems to high-performance computing. It is also designed to be compatible with a variety of technologies, including Ethernet, Serial RapidIO, and PCI Express.
When it comes to future applications, the XC6VLX365T-2FF1759I chip model is well suited for use in intelligent systems. It is capable of supporting a variety of technologies, including artificial intelligence, machine learning, and deep learning. It is also capable of supporting advanced networking technologies such as 5G, Wi-Fi 6, and Bluetooth 5.0. This makes it a great choice for applications such as autonomous vehicles, smart home systems, and IoT networks.
In terms of product description, the XC6VLX365T-2FF1759I chip model is designed to deliver high-speed, low-power, and cost-effective solutions. It is designed to be compatible with a variety of technologies, including Ethernet, Serial RapidIO, and PCI Express. It is also designed to be compatible with a wide range of operating systems, including Linux, Windows, and Android. It is also designed to be compatible with a variety of development tools, including Vivado Design Suite, Xilinx SDK, and Xilinx Platform Studio.
When it comes to actual case studies, the XC6VLX365T-2FF1759I chip model has been used in a variety of applications, including autonomous vehicles, smart home systems, and IoT networks. It has also been used in a variety of industrial applications, including machine vision systems, industrial automation systems, and robotics.
When it comes to precautions, it is important to note that the XC6VLX365T-2FF1759I chip model is designed to be compatible with a variety of technologies, but it is not designed to support all technologies. It is important to ensure that the chip model is compatible with the specific technologies required for the application. Additionally, it is important to ensure that the chip model is configured correctly to meet the specific requirements of the application.
Overall, the XC6VLX365T-2FF1759I chip model is a powerful model developed by Xilinx, Inc. It is designed to deliver high-speed, low-power, and cost-effective solutions for applications that require high-performance, low-power, and cost-effective solutions. It is also designed to be compatible with a variety of technologies, including Ethernet, Serial RapidIO, and PCI Express. It is well suited for use in intelligent systems, and it has been used in a variety of applications, including autonomous vehicles, smart home systems, and IoT networks. When it comes to precautions, it is important to ensure that the chip model is compatible with the specific technologies required for the application and that it is configured correctly to meet the specific requirements of the application.
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2,753 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $5,449.5396 | $5,449.5396 |
10+ | $5,390.9424 | $53,909.4240 |
100+ | $5,097.9564 | $509,795.6400 |
1000+ | $4,804.9704 | $2,402,485.2000 |
10000+ | $4,394.7900 | $4,394,790.0000 |
The price is for reference only, please refer to the actual quotation! |