XC6VLX195T-3FF1156C
XC6VLX195T-3FF1156C
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rohs

AMD Xilinx

XC6VLX195T-3FF1156C


XC6VLX195T-3FF1156C
F20-XC6VLX195T-3FF1156C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-1156
FBGA-1156

XC6VLX195T-3FF1156C ECAD Model


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XC6VLX195T-3FF1156C Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1 V
Number of Inputs 600
Number of Outputs 600
Number of Logic Cells 199680
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 1.412 GHz
Power Supplies 1,1.2/2.5 V
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B1156
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1156
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1156,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description FBGA-1156
Pin Count 1156
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC6VLX195T-3FF1156C Datasheet Download


XC6VLX195T-3FF1156C Overview



The XC6VLX195T-3FF1156C is a powerful chip model designed for high-performance digital signal processing, embedded processing, image processing, and other applications. It is a Field Programmable Gate Array (FPGA) device, which means it can be programmed using a Hardware Description Language (HDL) to customize its function.


The original design intention of the XC6VLX195T-3FF1156C was to create a powerful, flexible solution for digital signal processing and image processing applications. The chip model is equipped with a vast array of features, including a high-speed transceiver, multiple clock management blocks, and a wide range of I/O options. It also offers a high-performance, low-power solution for these applications.


In terms of upgradability, the XC6VLX195T-3FF1156C is capable of being upgraded with new features and capabilities. This is possible through the use of the latest versions of the HDL language, which allow for the addition of new features and functions. Additionally, the chip model can be used in advanced communication systems, such as those used in the Internet of Things (IoT).


When it comes to product description and specific design requirements, the XC6VLX195T-3FF1156C is a highly capable chip model. It is equipped with a vast array of features and capabilities, including a high-speed transceiver, multiple clock management blocks, and a wide range of I/O options. Additionally, the chip model is capable of being upgraded with new features and capabilities through the use of the latest versions of the HDL language.


In terms of actual case studies, the XC6VLX195T-3FF1156C has been used in a variety of applications, including image processing, digital signal processing, embedded processing, and advanced communication systems. Additionally, the chip model has been used in a variety of industries, such as aerospace, automotive, and medical.


When using the XC6VLX195T-3FF1156C, it is important to consider the specific design requirements and feature set of the chip model. Additionally, it is important to use the latest version of the HDL language to ensure that the chip model is properly configured and optimized for the desired application. Finally, it is important to consider the potential for future upgrades when designing a system that utilizes the XC6VLX195T-3FF1156C.



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QTY Unit Price Ext Price
1+ $2,206.3543 $2,206.3543
10+ $2,182.6301 $21,826.3008
100+ $2,064.0089 $206,400.8880
1000+ $1,945.3877 $972,693.8400
10000+ $1,779.3180 $1,779,318.0000
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