AMD Xilinx
XC6VLX130T-2FF484C
XC6VLX130T-2FF484C ECAD Model
XC6VLX130T-2FF484C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 240 | |
| Number of Outputs | 240 | |
| Number of Logic Cells | 128000 | |
| Combinatorial Delay of a CLB-Max | 4.29 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.286 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 3 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-484 | |
| Pin Count | 484 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC6VLX130T-2FF484C Datasheet Download
XC6VLX130T-2FF484C Overview
The XC6VLX130T-2FF484C chip model is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, which is a hardware description language used to program digital systems. This chip model is capable of high-speed operation and can be used in a variety of applications.
The chip model XC6VLX130T-2FF484C is designed to meet the needs of the industry and can be used in a variety of applications. The industry trends of this chip model will be determined by the specific technologies needed for the application environment. This chip model is also capable of future upgrades, depending on the specific needs of the application environment.
The original design intention of the chip model XC6VLX130T-2FF484C was to provide a powerful and efficient tool for high-performance digital signal processing, embedded processing, and image processing. It is also capable of being used in advanced communication systems, depending on the specific needs of the application environment. The chip model is also capable of being upgraded to meet the changing needs of the industry and the application environment.
In conclusion, the XC6VLX130T-2FF484C chip model is a powerful and efficient tool for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language and is capable of being upgraded to meet the changing needs of the industry and the application environment. The industry trends of this chip model and the possibility of future upgrades will depend on the specific technologies needed for the application environment.
You May Also Be Interested In
1,281 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,529.6000 | $2,529.6000 |
| 10+ | $2,502.4000 | $25,024.0000 |
| 100+ | $2,366.4000 | $236,640.0000 |
| 1000+ | $2,230.4000 | $1,115,200.0000 |
| 10000+ | $2,040.0000 | $2,040,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||