AMD Xilinx
XC6VHX565T-3FFG1923C
XC6VHX565T-3FFG1923C ECAD Model
XC6VHX565T-3FFG1923C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 720 | |
| Number of Outputs | 720 | |
| Number of Logic Cells | 566784 | |
| Number of CLBs | 44280 | |
| Combinatorial Delay of a CLB-Max | 590 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 44280 CLBS | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1923 | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1923 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1923,44X44,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 3.85 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC6VHX565T-3FFG1923C Datasheet Download
XC6VHX565T-3FFG1923C Overview
The chip model XC6VHX565T-3FFG1923C is a highly advanced integrated circuit that has been developed to meet the requirements of the modern computing world. It is designed to be used in a wide range of applications, from consumer electronics to industrial automation. It is an important component of the Internet of Things (IoT) and other emerging technologies.
The XC6VHX565T-3FFG1923C chip model is equipped with a variety of features that make it an ideal choice for many applications. It has a high degree of integration, which allows for a large number of components to be included on a single chip. This makes it much easier to design and build complex systems. It also has a high level of energy efficiency, which makes it suitable for use in energy-sensitive applications.
The XC6VHX565T-3FFG1923C chip model is expected to be in high demand in the future due to its advanced features and capabilities. As the demand for more sophisticated systems increases, the chip model will become increasingly important. It will likely be used in a variety of applications, from consumer electronics to industrial automation. It is also expected to be used in the development and popularization of intelligent robots, as it can provide the necessary computing power and flexibility required for such applications.
In order to effectively use the XC6VHX565T-3FFG1923C chip model, it is important to have the right technical skills and expertise. This includes knowledge of programming languages such as C and C++, as well as familiarity with the hardware and software components of the chip model. It is also important to have a good understanding of the various technologies that are used in the chip model, such as the ARM processor and the FPGA.
The XC6VHX565T-3FFG1923C chip model is an advanced integrated circuit that has the potential to revolutionize the way we use computers and other devices. It is expected to be in high demand in the future, and its use in the development and popularization of intelligent robots will be an important factor in the future of technology. In order to use the chip model effectively, it is important to have the necessary technical skills and expertise. With the right knowledge and expertise, the chip model can be used to create powerful and sophisticated systems that can be used in a variety of applications.
3,209 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||